Atotech Deutschland Gmbh

Bernd Roelfs

Heiko Brunner

Philip Hartmann

Dirk Rohde

Bert Reents

Soungsoo Kim

Markus Youkhanis

Thomas Pliet

Toshiya Fujiwara

Lars Kohlmann

Olivier Mann

Andreas Kirbs

Stefan Kretschmer

Rene Wenzel

Stefanie Ackermann

Agnieszka Witczak

Timo Bangerter

Jun Higuchi

Tafadzwa Magaya

Christian Ohde

Andre Schmökel

Angelo Ferro

René Wenzel

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper.

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

Method for copper plating

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

Electrolytic method for filling holes and cavities with metals

An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.

Aqueous, acid bath and method for the electrolytic deposition of copper

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Berlin, Germany

Bernd Roelfs