Siemens Aktiengesellschaft

Neue Materialien Bayreuth Gmbh

Kleb-und Giessharztechnik Dr. Ludeck Gmbh

Bernd Mueller

Ulrich Wittreich

Erwin Vachenauer

Andrey Prihodovsky

Gerhard Wagner

Michael Hanisch

Michael Niedermayer

Dirk Seehase

Dirk Wormuth

Heiko Huth

Ruediger Knofe

Wolfgang Ludeck

Mathias Nowottnick

The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.

Manufacture of electronic circuits

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T.

Heating element for SMD mounting

A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

Method for producing an electronic component, and electronic assembly, a heating device being provided in the substrate of the assembly

An airport-surveillance system for determining the position and identification of aircraft (4) on the airfield which utilizes secondary radar and includes an interrogation station (1) installed on the airfield (3) and from which the interrogation signal is transmitted by way of a narrow sharply forcused beam of an antenna which scans the airfield and further includes transponding stations installed in the aircraft (4). The present invention provides accurate identification and location of the aircraft by utilizing a receiver which has a sharply focused antenna beam and which is geographically located a distance away from the interrogation antenna and wherein the replies from the transponder of the aircraft are received by the receiving antenna only when the interrogation and receiving antenna beams (2, 22) intersect. By scanning all locations of the airport, the position and identification of all aircraft on the airport can be determined. A modification of the invention provides that instead of or in addition to the receiving station having a narrow beam antenna a number of receivers (5, 6 and 7) having omni-directional receiving antennas can be mounted at different locations on the airfield for determining the aircraft positions by using hyperbola locating techniques. The airport surveillance system of the invention is particularly suitable for large airports.

Airport-surveillance system

A circuit for the comparative vector measurement of keyed radio signal pulses, in particular DME pulses which arrive virtually simultaneously in a plurality of receivers and which can exhibit large level differences is utilized where, in each receiver, the pulses are fed to a switching amplifier which has an amplification which is adjustable in discrete stages and the reduction of which is effected automatically with the rise in the leading edge of the relevant signal pulse, and where, when the relevant switching amplifier of the receivers has been traversed, at a specific measuring time which is common to all receivers, the instantaneous amplitudes and instantaneous phases of the measuring signals are measured, the circuit providing that the pulses are fed to the switching amplifier by way of a delay device and, that for the setting of the amplification of the switching amplifier, a control circuit is provided which is directly fed with the radio pulses and which comprises a logarithmic amplifier and a subsequently connected analog-digital converter which is constructed as a comparator chain operating in parallel operation.

Circuit for the comparative vector measurement of radio signal pulses

Growing community of inventors

Falkenberg, Germany

Bernd Mueller