Intel Corporation

Bernd Memmler

Edmund Goetz

Peter Baumgartner

Jan-Erik Mueller

Reinhard Mahnkopf

Wolfgang Molzer

Thorsten Meyer

Hans-Joachim Barth

Sven Albers

Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Radio frequency shielding within a semiconductor package

Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

Stacked microelectronic dice embedded in a microelectronic substrate

Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.

Package vias for radio frequency antenna connections

Growing community of inventors

Riemerling, Germany

Bernd Memmler