International Business Machines Corporation

Bernd Marquart

Johann Greschner

Thomas Bayer

Olaf Wolter

Roland R Stoehr

Roland R Stohr

Willy Hildenbrand

Wolfram Brandt

A buckling beam test probe assembly for the electrical test of integrated circuit devices is provided having contact probes made of a composite material and a stripper plate constructed so as to allow scrubbing and controllable wiping of the contact probe on the surface of the device to be tested. The assembly is designed for the maximum number of expected contact probes. Only the contact probe compartments which are needed for testing the devices are populated.

Buckling beam test probe assembly

A modular multilayer interwiring structure comprising a plurality of relatively small parts which are produced separately as `sub-units` (1). Each individual layer of the final structure is formed by joining a respective set of unit parts in one plane. The whole multilayer structure is then built by stacking these layers, preferably so that the units of one layer are not vertically aligned with the units of an adjacent layer. Each unit part includes at least one layer of conductive material (8, 9) on its front and/or rearside. These conductive layers may be individually patterned into diverse interconnection lines (5). Throughconnections (6) extending from the frontside to the backside of the units are provided using a desired set or a standardized array of via holes or openings filled with conductive material. By connecting desired throughconnections to the respective conduction lines, each unit may form an individual part of a more complex multilayer interwiring structure.

Modular multilayer interwiring structure

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Schonbuch, Germany

Bernd Marquart