Siemens Aktiengesellschaft

Rolls-royce Deutschland Ltd & Co. Kg

Rehm Thermal Systems Gmbh

Kleb- Und Gießharztechnik Dr. Ludeck Gmbh

Ludeck, Wolfgang

Bernd Müller

Klaus Wilke

Stefan Stegmeier

Jörg Strogies

Ulrich Wittreich

Stefan Nerreter

Martin Franke

Rüdiger Knofe

Peter Frühauf

Rene Blank

Andrey Prihodovsky

Matthias Heimann

Peter Prankh

Wilhelm Meyrath

Michael Hanisch

Roland Lorz

Nora Jeske

Franz Pfleger

Michael Niedermayer

Marco Matiwe

Dennis Sommerfeld

Manfred Zäske

Heiko Huth

Wolfgang Ludeck

Mathias Nowottnick

Dirk Seehase

Dirk Wormuth

Hartmut Meier

Christian Nachtigall-Schellenberg

Kay Jarchoff

Janet Babatz

Christian Radüge

Carsten Borwieck

Various embodiments of the teachings herein include a method for monitoring a flux application in a soldering process. An example includes: defining flux wetting surfaces in relation to an image of an application surface; generating a thermographic recording of the application surface selectively provided with liquid flux; defining adjustment points on the application surface which can be identified on the image and on the thermographic recording; superimposing the image and the thermographic recording on the basis of the adjustment points; and comparing the position of temperature anomalies on the application surface identified by the thermographic recording with the position of the flux wetting surfaces on the image.

Monitoring a flux application

Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.

Semifinished product for populating with components and, method for populating same with components

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (), characterized by at least one separating element () formed in the wiring carrier plate (), which separating element divides the wiring carrier plate () into sections separated by the separating element (), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks () arranged on the wiring carrier plate (), and power semiconductors ().

Vibration-damped circuit arrangement, converter, and aircraft having such an arrangement

Various embodiments include a capacitor structure comprising: a plurality of capacitors disposed in a support structure, wherein each of the plurality of capacitors includes a first capacitor electrode and a second capacitor electrode. The support structure includes a first electrode and a second electrode. Each of the plurality of capacitors makes electrical contact with the first electrode via the respective first capacitor electrode and with the second electrode via the respective second capacitor electrode. The support structure includes a mounting side for surface mounting, the mounting side comprising a first contact area of the first electrode and a second contact area of the second electrode. The support structure defines a cuboid interior and the capacitors are disposed in the cuboid interior. An outer side of the support structure defines an additional structural framework outside the mounting side.

Capacitor structure and power module having a power electronic component

Various embodiments include a power module comprising: a first power electronics device arranged on a first substrate board; and a second power electronics device mounted on a second substrate board. The first substrate board, the first device, the second substrate board, and the second device are arranged on a first baseplate stacked above one another or in planar fashion beside one another.

Power module having a power electronics device on a substrate board, and power electronics circuit having such a power module

Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

Semiconductor component and method for producing same

Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.

Power electronic circuit having a plurality of power modules

Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.

Electrical assembly

Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.

Pourous heat sink with chimney

A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. If a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection.

Carrier with a test surface wettable with liquid solder and method for application thereof

The present invention is directed to a cleaning device for process gases of a reflow soldering system that includes a plurality of cleaning chambers. The plurality of cleaning chambers contain a cleaning liquid for the process gas, where each of the cleaning chambers is adapted to be flown through via a supply line for the contaminated process gas and via a discharge line for the cleaned gas. The cleaning chambers also include a plurality of cleaning walls along which the cleaning liquid is flown for take-up of impurities in the process gas into the cleaning liquid. A plurality of the deposition walls is provided, where at least one of the deposition walls also forms an outer wall of the cleaning device.

Cleaning device for cleaning process gas of a reflow soldering system

Growing community of inventors

Falkenberg, Germany

Bernd Müller