Brown, Boveri & Cie Ag

Bernd Leukel

Arno Neidig

Klaus Bunk

Hubert Hettmann

Werner Weidenauer

Lutz Bergmann

A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwiches and the carrier unit together with a low-melting solder in a second step; performing the first and second soldering steps without flux in a gas from the group consisting of hydrogen and forming gas; and preventing a mixture of the high-melting solder and the low-melting solder during the second step.

Method for manufacturing semiconductor power modules with an insulated

A power transistor module includes a housing having a frame forming a housing wall and a ceramic plate fastened to the frame forming a housing bottom, structured metallizations disposed on the ceramic plate forming conductor runs and terminal pads, components including at least one power transistor and a bypass diode connected to the terminal pads, wiring elements being connected to the components and being freely accessible from the top of the housing, the wiring elements including an auxiliary collector terminal, and an auxiliary diode connected between the auxiliary collector terminal and the collector electrode of the power transistor.

Power transistor module

In this static converter module, which is equipped with thyristors, diodes or power transistors, mounting lugs (4,11) having mounting holes (5,6,12,13) are used for mounting the module on a heat sink. The housing of the module is essentially formed by a frame (1,10) which is open at the top and at the bottom and by a ceramic plate which is inserted into the base part of the frame. For the purpose of fixing the ceramic plate in place, a peripheral indentation (7,15) is provided in the base part of the frame. In order to prevent mechanical stresses in the area of the mounting holes/mounting lugs from being transmitted to the ceramic plate, slits (9) are provided between the frame walls and the mounting holes. As an alternative to this, the peripheral indentation (15) can be provided with steps in such a manner that in the area of the two frame walls provided with the mounting lugs (11) a slot-shaped recess (16) is produced between the ceramic plate and the peripheral indentation (15).

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Weinheim, Germany

Bernd Leukel