Siemens Aktiengesellschaft

Schwaiger Gmbh

Eichenauer Heizelemente Gmbh & Co. Kg

He System Electronic Gmbh & Co. Kg

Bernd Kürten

Benno Weis

Stefan Pfefferlein

Alexander Hensler

Lutz Namyslo

Daniel Kappauf

Philipp Oschmann

Felix Zeyss

Silvio Höhne

Thomas Grau

Robert Gospos

Michael Endres

Pietro Botazzoli

Christian Spiegel

Helmut Brendel

Silvio HÖHNE

Christian Schick

Gerd Hilbinger

Jörg Krieger

Thomas Neugebauer

Marion Junghänel

Harry Mohr

A housing part for accommodating a semiconductor element includes a pin partially molded in the housing part for electrical connection to a printed circuit board. The pin includes a bonding surface for producing an electrical connection between the pin and the semiconductor element. The housing part includes a bearing surface for the bonding surface and a recess formed in the bearing surface or adjoining the bearing surface. A vibration-damping material is at least partially filled in the recess and/or applied in a region adjoining the recess. The housing part is designed as a one-piece housing frame part.

Semiconductor component with damped bonding surfaces in a package with encapsulated pins

A power converter arrangement includes semiconductor arrangements for two motors, wherein a control unit is used to continuously form a sum current composed of a first current and a second current and the sum current is compared with a predeterminable maximum value in order to protect the motors from being destroyed, where the control unit includes a device in which a priority grade is input by a user, where the priority grade describes the priority of one of the two machines, and where the control unit reduces the current of the respective machine that lacks priority according to the priority grade when the maximum value is exceeded.

Power converter arrangement

A semiconductor arrangement includes a substrate, a semiconductor element connected to the substrate and including on a side remote from the substrate a contact surface which is connected to the substrate via a first bond connecting means such that as to form on the contact surface a stitch contact arranged between a first loop and a second loop of the first bond connecting means. The first loop has a first maximum and the second loop has a second maximum. A second bond connecting means has a first transverse arranged to run above the first stitch contact and, viewed running parallel to the contact surface, between the first maximum of the first loop and the second maximum of the second loop. The first transverse loop of the second bond connecting means is arranged to run below the first maximum of the first loop and/or the second maximum of the second loop.

Semiconductor arrangement comprising a semiconductor element, a substrate and bond connecting means

A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Power module having at least two power semiconductor arrangements that are contacted on a substrate

A structured metal layer in contact with an electronic component is applied on an upper side of a substrate of electrically insulating material. A metallic contact layer is applied to an underside of the substrate, with the underside configured as planar surface in a state of the substrate that is free of mechanical stress. The contact layer is connected to a metallic base plate via an intermediate layer. The contact layer is connected to the metallic base plate at an elevated temperature. The semiconductor module is then cooled. The side of the metallic base plate facing the substrate and the side of the metallic base plate facing away from the substrate are configured as planar surfaces in a state of the base plate that is free of mechanical stress. Upon cooling of the semiconductor module, the base plate forms a concave curvature on its side facing away from the substrate.

Semiconductor module having a base plate with a concave curvature

A converter filter includes an inductor having a main winding and a winding element, and first and second absorption circuits coupled to the inductor. The first and second absorption circuits are decoupled from one another by an inductance of the winding element of the inductor. An auxiliary winding is coupled to the inductor and forms a 1:1 transformer with the winding element. The auxiliary winding is fed via the inductance of the winding element. The auxiliary winding and the second absorption circuit are each connected to an output of the winding element and the first absorption circuit is connected to the auxiliary winding.

Mains filter for converter

Various designs of configurable multiswitch or multifeed satellite reception systems comprising switch-over matrices and transponder branches and 'one cable solutions' which allow or do not allow subsequent expansion with respect to the subscribers that can be connected thereto are known from the prior art. In general, the costs for such systems comprising frequency converters are primarily determined by the frequency converters and the associated filters. The aim of the invention is to devise inexpensive methods or devices which allow detection of the complete frequency spectrum&#x2014;even after subsequent expansions&#x2014;and which therefore do not involve any restrictions with respect to the program range. The device for the freely programmable conversion of 1 to m transponders in n transponder blocks (TBto TBn) of a satellite reception system comprises the following elements: a satellite antenna (S) comprising at least one LNB reception converter (LNB, LBN) to the outputs of which the respective satellite IF plane is applied; a multiswitch (MS) connected to the outputs of the one or more LNB reception converters (LNB, LNB); n converters (U) which are arranged in parallel to each other; mid a combinatorial circuit (VS) connected to the converters (U) to combine the n transponder blocks (TBto TBn) to an output spectrum, the device making all configured transponders available to every receiver in the manner of a satellite head end. The invention is used in the field of satellite reception and distribution systems as a head end.

Satellite reception and distribution system for use as a head end with programmable transponder conversion of transponder blocks

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Obermichelbach, Germany

Bernd Kürten