Advanced Semiconductor Engineering, Inc.

Bernd Karl Appelt

You-Lung Yen

Kay Stefan Essig

An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.

Electronic package and method of forming the same

An electronic package includes a carrier, a protection layer and an electronic component. The carrier includes a dielectric layer and a pad in contact with the dielectric layer. The protection layer at least partially covers the pad. The electronic component is located over the protection layer and electrically connected to the pad. At least one portion of the protection layer under the electronic component is substantially conformal with a profile of the pad or with a profile of the dielectric layer.

Electronic package including a protection layer

A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a substrate, a semiconductor device, an encapsulant, a balance structure, and a warpage-resistant layer. The semiconductor device is disposed on the substrate. The encapsulant encapsulates the semiconductor device. The balance structure is on the semiconductor device and contacting the encapsulant. The warpage-resistant layer is between the semiconductor device and the balance structure. The encapsulant contacts a lateral surface of the warpage-resistant layer.

Semiconductor package structure and method for manufacturing the same

An electronic carrier and a method of manufacturing an electronic carrier are provided. The electronic carrier includes a first interconnection structure and a second interconnection structure. The first interconnection structure includes a first patterned conductive layer having a first pattern density. The second interconnection structure is laminated to the first interconnection structure and includes a second patterned conductive layer having a second pattern density higher than the first pattern density. The first interconnection structure is electrically coupled to the second interconnection structure through a first non-soldering joint between and outside of the first interconnection structure and the second interconnection structure.

Electronic carrier and method of manufacturing the same

A electronic package and a method of manufacturing the same are provided. The electronic package includes an electronic component, a thermal spreading element, and an encapsulant. The electronic component has a first surface. The thermal spreading element is disposed over the electronic component and has a first surface facing the first surface of the electronic component. The encapsulant covers the electronic component and has a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component.

Electronic package and method of manufacturing the same

An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.

Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure

A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first package and a second package. The first package includes a first substrate, an electronic component, a trace layer, and a first conductive structure. The first substrate has a first surface and a second surface opposite to the first surface. The electronic component is embedded in the first substrate. The trace layer has an uppermost conductive layer embedded in the first substrate and exposed from the first surface of the first substrate. The first conductive structure electrically connects the trace layer to the second surface of the first substrate. The second package is disposed on the first surface of the first substrate of the first package.

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Holly Springs, NC, United States of America

Bernd Karl Appelt