Leybold Aktiengesellschaft

Balzers Und Leybold Deutschland Holding Ag

Leybold-Heraeus Gmbh

Bernd Hensel

Hermann Koop

Dieter Hofmann

Eberhard Feick

Friedrich Hofmann

Franz Richter

Michael Scherer

Wolf-Dieter Munz

Uwe Kopacz

Otto Knotek

Hans Schussler

Wolf-Eckhart Fritsche

Manfred Reus

Gunter Eckhardt

Paul Kaiser

A disc lacquering station, a laser beam recorder, a developing station and a metallizer are arranged in tandem. A cassette station (7) for the intermediate storage of substrates precedes and another follows the laser beam recorder. The cassette station (7) has a fixedly installed buffer magazine (9) for substrates and an extra magazine (10), removable from the apparatus, for additional substrates. In this manner substrates can be taken with the extra magazine from the cassette station preceding the laser beam recorder, recorded on a separate laser beam recorder, and then air-locked back into the production apparatus.

Apparatus for the production of exposed and metallized substrates

In an apparatus for the laser beam exposure of a substrate disc (5), linked block tables (19, 29) are provided, which have each a piezotranslator (24, 31). This makes it possible to perform a fine correction of the movements very rapidly and very precisely.

Apparatus for laser beam exposure of a substrate disc

A vertically disposed drive spindle (5) rotates turntable (6) supporting a substrate (7) at high speed, the turntable having a smaller diameter than the substrate. Coaxial with the turntable (6), a centering ring (10) having a frustoconical inside surface can be raised vertically between a lower and upper position. The latter has on its upper side a greater diameter and on its lower side a smaller diameter than the substrate (7). In its lower position the centering ring (10) is at a distance from a substrate (7) lying on the turntable (6), but in its upper position its inside surface supports the substrate (7) at an axial distance above turntable (6).

Apparatus for laser exposure of a substrate disk and a method for the

A plate made of silicate glass (glass master) (3) is provided with a pressing surface (surface coat) carrying the sound recording in the form of raised contours formed from a photoresist (5) with a layer of primer (adhesion promotor) (4) to hold the photoresist layer (5) to the glass plate (3). A first metal layer (6) is deposited on the photoresist (5) from a sputter target which consists of a NiV alloy; and a protective layer (7) of nickel is electrolytically deposited on the first layer. The metal master (8) consisting of first layer (6) and protective layer (7) is pulled from the photoresist layer (5).

Master for the duplication of sound recordings and process for its

Surface coating includes alternating first and second ternary layers, wherein the first layer TiAlN.sub.x has a higher nitrogen content and is considerably thinner than the second layer TiAlNy. The first layer is preferably applied by decreasing the nitrogen content of a reactive atmosphere from a maximum to a minimum during sputtering of a TiAl target. The second layer is then applied by sputtering the TiAl target over a longer period of time while the nitrogen content is maintained constant at the minimum. When a further first layer is applied, the nitrogen is again increased to the maximum.

Multilayer Ti-Al-N coating for tools

A device for coating substrates has a rectangular magnetron cathode 2 with a target, a substrate holder 16 that can be rotated around a rotating axis 17 which is parallel to the longitudinal edges of the target, a planar wall 20 made of a non-magnetic material and having longitudinal edges 21, 22 also parallel to the rotating axis 17. Behind the wall there is a magnet arrangement and the magnetron cathode 2 and the wall 20 are disposed on opposite sides of the rotating axis. The device further includes a planar anode. In order to intensify and the effect of the plasma and render it more uniform, the distance on the substrate path between the longitudinal edges 12, 13 of the target and the longitudinal edges 21, 22 of the wall parallel thereto is reduced by at least one additional wall 25, 26 with a magnet arrangement 27, 28 disposed therebehind. Further, the poles of all the magnet arrangements 23, 27, 28 alternate on the circumference of the substrate holder 16 such that the entire circumference of the substrate holder is surrounded by an uninterrupted series of magnetic tunnels.

Apparatus for coating three dimensional substrates by means of cathode

An etching method whereby a sufficiently high etching rate is attained, in a uniform surface treatment that is very gentle on projecting edges of the substrates. Also the substrates are held at or brought to a sufficiently high temperature by the etching process. The method for etching substrates with a magnetic-field supported low-pressure discharge is characterized in that the magnetic field is decoupled from the substrates such that the magnetic field strength at the substrates is less than 6000 A/m. In the space between the substrates and the magnet system at least one electron emitter is disposed at a location at which a magnetic field strength is present that is greater than the field strength at the substrates but equal to or less than 12,000 A/m. On the side of the substrates facing away from the at least one electron emitter, at least one anode is disposed with an anode potential of +10 to +250 V with respect to ground. An etching potential between -100 V and -1000 V with respect to ground is applied to the substrates. The ratio of the gaps between the substrates and the surfaces of the substrates projected onto a projection plane carried through the gaps amounts to at least 0.1. The potential difference between the at least one emitter and the at least one anode is selected so high that an electron current (primary and secondary electrons) flows through the substrate gaps to the anode.

Method and apparatus for etching substrates with a magnetic-field

Process and apparatus for coating a tool with a layer of a compound which contains at least one of carbon and nitrogen and at least one of titanium, zirconium, chromium, tungsten, tantalum, vanadium, niobium, hafnium and molybdenum. The apparatus includes a vacuum chamber and a substrate holder for accommodating at least one tool with the substrate holder at a bias of between -40 and -200 V relative to ground. The apparatus includes at least two magnetron sputtering cathodes disposed in mirror symmetry to the substrate holder. The target contains at least one metal selected from the group consisting of T, Zr, Cr, W, Ta, V, Nb, Hf and Mo. The apparatus includes at least one gas source for supplying the vacuum chamber with a noble gas and a reaction gas. The reaction gas contains at least one of nitrogen and a gaseous carbon compound. The apparatus includes at least one anode in the edge region of each target so that the anodes are positioned in mirror symmetry with respect to the target holder. Each of the anodes is connected to a voltage means for applying a voltage of +10 to +200 V relative to ground.

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Eschborn, Germany

Bernd Hensel