W.c. Heraeus Gmbh

Heraeus Deutschland Gmbh & Co Kg

Heraeus Materials Technology Gmbh & Co. Kg

Bernd Gehlert

Frank Krüger

Harald Manhardt

Gunter Herklotz

Eckhard Ditzel

Thomas Frey

Reinhold Weiland

Ingo Prunzel

Rolf Paulsen

Thomas Hild

Patrick Baake

A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face.

Strip-type substrate for producing chip card modules

A contact body, especially for switching contacts, has a substrate and a contact layer. The substrate is formed as a wire and the contact layer is arranged directly on the wire.

Contact arrangement and use thereof

A thin galvanically deposited gold-containing surface layer is backed by a support layer containing a palladium alloy and having a thickness between 0.05 .mu.m and 0.5 .mu.m. In a preferred embodiment the surface layer and the support layer have a combined thickness of less than 0.5 .mu.m.

Electric outlet element having double flash

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Bruchköbel, Germany

Bernd Gehlert