Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Osram Gmbh

Bernd Boehm

Andreas Ploessl

Georg Rossbach

Frank Singer

Hubert Halbritter

Matthias Sabathil

Lorenzo Zini

Roland Enzmann

Roland Schulz

Bjoern Hoxhold

Korbinian Perzlmaier

Andreas Dobner

Heribert Zull

Albrecht Kieslich

Markus Broell

Christian Rumbolz

Michael Huber

Mathias Kaempf

Markus Arzberger

Thomas Veit

Ludwig Hofbauer

Jens Dennemarck

Stefan Hartauer

Andreas Waldschik

Jana Sommerfeld

Daniel Zaspel

Martin Herz

Sebastian Hoibl

Stefan Rass

Hermann Nuss

Erwin Beer

Stefan Merl

Matthias Stark

In an embodiment an optoelectronic device includes a carrier and a plurality of semiconductor chips fastened on the carrier by a connector, wherein each semiconductor chip has at least one contact pad on a main surface facing away from the carrier, wherein each contact pad is contacted electrically by an interconnecting track, and wherein the interconnecting track is guided over an edge of the main surface of the semiconductor chip onto the carrier.

Optoelectronic device and method for producing an optoelectronic device

An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.

Optically effective element, method of producing an optically effective element, and optoelectronic component

The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body () having a radiation-permeable surface (), and introducing structures () into the semiconductor body () on the radiation-permeable surface (), wherein the structures () are quasi-regular.

Method for producing an optoelectronic semiconductor chip having structures at the radiation passage surface, and optoelectronic semiconductor chip having structures at the radiation passage surface

An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.

The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (), comprising the following steps: A) arranging at least one semiconductor chip () on a carrier (), B) applying an electrically insulating photoresist () to a top side () of the carrier () and to the semiconductor chip (), C) curing the photoresist () with a baking step, D) patterning the photoresist () by exposure, F) developing the photoresist (), wherein the photoresist () is removed at least from a radiation penetration surface () of the semiconductor chip (), G) again curing the photoresist () with a baking step, and H) applying an electrically conductive contact layer () to the photoresist (), wherein the electrically conductive contact layer () is in places at a distance (A) from a marginal surface () of the photoresist () which faces towards the semiconductor chip (), wherein the marginal surface () facing towards the semiconductor chip () is exposed in places.

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

The invention relates to a method for separating regions of a semiconductor layer and for introducing an outcoupling structure into an upper side of the semiconductor layer, the outcoupling structure being provided to couple light out of the semiconductor layer. The upper side of the semiconductor layer is covered by a mask having first openings for introducing the outcoupling structure and at least a second opening, which is provided to introduce a separating trench into the semiconductor layer. With the aid of an etching method, the outcoupling structure is introduced into the upper side of the semiconductor layer in the region of the first openings and simultaneously a separating trench passing through the semiconductor layer is introduced into the semiconductor layer via the second opening, and a region of the semiconductor layer is separated.

Method for separating regions of a semiconductor layer

A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.

Method for singulating a component composite assembly

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Obertraubling, Germany

Bernd Boehm