Deutsche Cell Gmbh

Solarworld Innovations Gmbh

Solarworld Industries Gmbh

Bernd Bitnar

Andreas Krause

Holger Neuhaus

Martin Kutzer

Frederick Bamberg

Matthias Georgi

Marc Dietrich

Kristian Schlegel

Reinhold Schlosser

Claudia Lengsfeld

Alexander Fuelle

Frank Wecke

A bifacial photovoltaic module with at least one bifacial solar cell is provided. The at least one bifacial solar cell includes a substrate with a front-side and a rear-side. The front-side is the light incident side and the rear-side has rear-side contact structure. The rear-side contact structure includes a plurality of electrically conductive contact fingers, which have a first metal, a plurality of solder pads electrically connected to the contact fingers. The solder pads have a top. The solder pads have a second metal, which is different from the first metal. The rear-side contact structure further includes several cell connectors electrically connected to the solder pads. The top of the solder pads is free from the contact fingers in an area along one direction. The cell connectors are disposed planar on or above this area.

Bifacial photovoltaic module

In different exemplary embodiments, a solar cell is provided, including: a substrate with a first region and a second region, wherein the first region includes at least a first electrical conductivity and the second region includes at least a second electrical conductivity which is greater than the first electrical conductivity; and a passivation on the surface of the substrate; and a contact-structure on the surface of the substrate, wherein the contact-structure includes a plurality of contacts; wherein two contacts of the plurality of contacts are disposed at a first distance with respect to each other in the first region; wherein two further contacts of the plurality of contacts are disposed at a second distance with respect to each other in the second region; and wherein the second distance is greater than the first distance.

Solar cell and method of manufacturing

The invention relates to a method for masking a semiconductor substrate including the following steps: providing a planar semiconductor substrate having a first side and a second side lying opposite thereto, applying a mask to at least one of the sides, an extrusion printing method being used for applying the mask.

Masking method

A method for the production of a contact structure of a semiconductor component comprises the masking of at least one side of a semiconductor substrate with a coating and the partial removal thereof in at least one pre-determined region.

Method for producing a contact structure of a semiconductor component

A semiconductor component, in particular in the form of a solar cell, comprises a two-dimensional semiconductor substrate with a first side, a second side which is arranged opposite thereto, a surface normal which is perpendicular to said first and second sides, and a plurality of recesses which are at least arranged on the second side and extend in the direction of the surface normal, at least one dielectric passivation layer which is arranged on the second side, an electrically conducting contact layer arranged on the passivation layer, a plurality of contact elements for electrically connecting the contact layer with the semiconductor substrate, which contact elements are electrically conductive, are in electrically conducting connection with both the semiconductor substrate and with the contact layer, fill at least 50%, in particular at least 90%, preferably 100% of in each case one of the recesses, project beyond the recesses with a projection in the direction perpendicular to the surface normal and are of an easily solderable material.

Semiconductor component

A method for the production of a contact structure of a solar cell allows p-contacts and n-contacts to be produced simultaneously.

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Freiberg, Germany

Bernd Bitnar