Siemens Aktiengesellschaft

Bernd Beyer

Markus Stark

Peter Tichy

Helmut Repp

Markus Hemmerlein

Florian Hofmann

Horst Friesner

Wolfgang Schnitzerlein

The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.

Holding apparatus

A retaining facility for clearance-free fixing of a printed circuit board onto a one-dimensional curved surface is provided. In the direction of curvature of the one-dimensional curved surface, a tensile or compressive force acts on the printed circuit board or on at least one first connection device connected to the latter, with the printed circuit board being bent and pressed onto the curved surface. In this way the printed circuit board is held solidly and with little vibration on the surface even when acted on by centrifugal forces.

Retaining facility for printed circuit boards on curved surfaces

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Langensendelbach, Germany

Bernd Beyer