Osram Opto Semiconductors Gmbh

Siemens Aktiengesellschaft

Osram Gmbh

Infineon Technologies Ag

Osram Opto Semiconductor Gmbh

Bernd Barchmann

Walter Wegleiter

Ralph Wirth

Karl Weidner

Axel Kaltenbacher

Jan Marfeld

Oliver Wutz

Gertrud Kräuter

Johann Ramchen

Thomas Schwarz

Norwin Von Malm

Georg Bogner

Stefan Illek

Matthias Sabathil

Frank Pueschner

Michael Zitzlsperger

Krister Bergenek

Patrick Rode

Andreas Ploessl

Lutz Hoeppel

Andreas Dobner

Andreas Biebersdorf

Norbert Stath

Stefan Gruber

Dirk Becker

Gertrud Kraeuter

Erik Heinemann

Josef Heitzer

Martin Petz

Andreas Waldschik

J&uuml;rgen Winterer

Florian Boesl

Björn Hoxhold

Xaver Schl&ouml;gel

Philipp Schlosser

Stefan Schmausser

Walter Juri

Otto Voggenreiter

Siegfried Fischer

Otto Gruber

J&uuml;rgen Steinbichler

Fabian Eigenmann

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.

Optoelectronic semiconductor component

A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.

A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.

A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top. The carrier has a metallic core material and at least on the carrier top a metal layer. A dielectric mirror is applied to the core material. At least two holes are formed through the carrier. A ceramic layer with a thickness of at most 150 &#x3bc;m at least on the carrier underside and in the holes is produced. The ceramic layer includes the core material as a component. Metallic contact layers are applied to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes. At least one radiation-emitting semiconductor chip is applied to the carrier top and the semiconductor chip is electronically bonded to the contact layers.

Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component

A method for producing a multiplicity of semiconductor chips () is provided, comprising the following steps: &#x2014;providing a wafer () comprising a multiplicity of semiconductor bodies (), wherein separating lines () are arranged between the semiconductor bodies (), &#x2014;depositing a contact layer () on the wafer (), wherein the material of the contact layer () is chosen from the following group: platinum, rhodium, palladium, gold, and the contact layer () has a thickness of between 8 nanometers and 250 nanometers, inclusive, &#x2014;applying the wafer () to a film (), &#x2014;at least partially severing the wafer () in the vertical direction along the separating lines () or introducing fracture nuclei () into the wafer () along the separating lines (), and &#x2014;breaking the wafer () along the separating lines () or expanding the film () such that a spatial separation of the semiconductor chips () takes place, wherein the contact layer () is also separated. A semiconductor chip, a component and a method for producing the latter are also provided.

Semiconductor chip, method for producing a plurality of semiconductor chips and method for producing an electronic or optoelectronic device and electronic or optoelectronic device

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via including an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via includes a contact pin, the contact pin including an electrically conductive material; and the contact pin is laterally completely enclosed by the shaped body.

In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.

Lighting unit having a plurality of light emitting diodes

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.

An opto-electronic component has a carrier element () with a connection region (). Arranged on the carrier element () is a semiconductor chip (). A contact region () is mounted on the surface () of the semiconductor chip () remote from the carrier element (). The connection region () is electrically conductively connected to the contact region () by way of an unsupported conductive structure (). A method for manufacturing an opto-electronic component is described.

Optoelectronic component and method for producing an opto-electronic component

A method can be used to produce a housing for an optoelectronic semiconductor device. A reflector part, which has an inner area configured to reflect electromagnetic radiation, is encased in places with a housing material using an injection molding method. The inner area of the reflector part remains free of the housing material at least in places. The reflector part is formed with a first plastic material and the housing material is formed with a second plastic material that is different than the first plastic material. The first plastic material and the second plastic material differ from one another with regard to at least thermal stability or resistance to electromagnetic radiation.

Housing that includes reflector part and housing material formed with plastic material

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body, at least one plated-through hole including an electrically conductive material, and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein, the plated-through hole is arranged in a manner laterally spaced apart from the semiconductor chip, the plated-through hole completely penetrates through the shaped body, and the plated-through hole extends from a top side of the shaped body to an underside of the shaped body, the electrically conductive connection extends at the top side of the shaped body.

A semiconductor lighting device may include a substrate populated with at least one semiconductor light source, wherein at least one reflective surface region of the substrate is covered with a light-reflecting layer, and wherein the light-reflecting layer has an aluminum carrier coated in a reflection-intensifying manner.

Semiconductor light-emitting device with reflective surface region

A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.

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Wuppertal, Germany

Bernd Barchmann