Dow Corning Corporation

Dow Corning Toray Silicone Company Limited

Bernard Vanwert

Martin E Cifuentes

Michael Raymond Strong

Randall Gene Schmidt

Michael A Lutz

William P Brady

William J Schoenherr

Myron T Maxson

Gary A Vincent

David L Stickles

Chi-long Lee

Katsutoshi Mine

Don Lee Kleyer

Kazumi Nakayoshi

Steven Walter Wilson

Osamu Mitani

Brian Paul Loiselle

William Neal Fenton

James Anderson Beck

William E Dennis

Dawn M Houghtaling

Myron T Mason

The present invention relates to electrically conductive silicone compositions comprising an organopolysiloxane containing at least two alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, a platinum group metal containing catalyst, a conductive metal particulate, a precrosslinked elastomeric silicone particle, and a non-reactive volatile diluent. The electrically conductive silicone compositions of this invention are useful as electrically conductive adhesives and coatings for electrical and electronic devices. The cured electrically conductive silicone compositions of this invention have high electroconductivity and rubbery elasticity.

Electrically conductive silicone compositions

Organosiloxane compositions that cure in the presence of ultraviolet radiation comprise a alkenyl-substituted fluorinated polyorganosiloxane, a mercaptoalkyl-substituted fluorinated polyorganosiloxane and a photoinitiator. The cured compositions are particularly useful as coating and encapsulants to protect electronic devices that are exposed to hydrocarbon fuels.

Radiation curable fluorinated organosiloxane compositions

A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising

Moisture-curable hot melt silicone pressure-sensitive adhesives

Silicone pressure sensitive compositions that combine high ultimate strength in a cured network with a lower modulus and have improved adhesive strength at elevated temperatures are disclosed. The pressure sensitive adhesive compositions are comprised of (A) a soluble, capped, organopolysiloxane resin containing less than 1.2 weight percent silicon-bonded hydroxyl groups based on the total weight of (A); (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least two silicon-bonded hydrolyzable radicals said polymer having a viscosity at 25.degree. C. of 20 to 100,000 mm.sup.2 /s; and (C) a hydrolyzable silane.

Silicone pressure sensitive adhesive composition

The present invention relates to a silicone pressure-sensitive adhesive composition which cure upon exposure to ambient moisture. The moisture-curable silicone pressure-sensitive adhesive composition of the instant invention comprise: (A) an organopolysiloxane resin containing curing radicals of the formula --SiY.sub.2 ZNY'ZSiR.sup.1.sub.x Y'.sub.3-x wherein R.sup.1 is a monovalent hydrocarbon radical, each Z is a divalent linking group, each Y is independently selected from the group consisting of a monovalent organic radical, an enoloxy radical, an alkoxy radical, and an oximo radical; Y' is selected from the group consisting of a monovalent organic radical, a hydrogen atom, and --ZSiR.sup.1.sub.x Y'.sub.3-x ; Y' is selected from the group consisting of an enoloxy radical, an alkoxy radical, and an oximo radical; and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radicals selected from the group consisting of hydroxyl radicals, alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, enoloxy radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25.degree. C. of 20 to &lt;100,000 mm.sup.2 /s and the weight ratio of said resin to said polymer being in the range 5:95 to 90:10; (C) optionally, sufficient catalyst to accelerate the cure of said composition; (D) optionally a silane of the formula R.sup.2.sub.4-y SiX.sub.y or oligomeric reaction product thereof, in which R.sup.2 is selected from the group consisting of hydrocarbon radicals and substituted hydrocarbon radical having 1 to 6 carbon atoms, X is a hydrolyzable group and y is 2 to 4; and (E) optionally, a filler.

A stream of a molten moisture curable organosiloxane composition is entrained in a current of a heated gas containing a concentration of water vapor below the saturation level of the gas at 25.degree. C. The gas current directs the organosiloxane composition toward the surface to be coated and provides an environment adjacent to the surface of the coated substrate that causes at least the surface layer of the composition to cure at a rate that is substantially constant and independent of the temperature and humidity in the macroscopic environment of the substrate.

Method and apparatus for applying coatings of molten moisture curable

A moisture-curable silicone hot melt pressure sensitive adhesive composition is disclosed, said composition comprising: (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula --ZSiR.sup.1.sub.x (OR.sup.2).sub.3-x ; wherein R.sup.1 is a monovalent hydrocarbon radical, R.sup.2 is selected from the group consisting of a alkyl radical and alkoxyalkyl radical, Z is a divalent linking radical, and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25.degree. C. of 20 to &lt;100,000 mm.sup.2 /s, and the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; and (C) sufficient catalyst to accelerate the cure of said composition; said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.

Curable adhesive compositions comprise combinations of organosiloxane MQ resins and liquid polyorganosiloxanes of specified viscosity and functionality. The compositions are substantially free of unreactive materials and are applied in the molten state. Depending upon the concentration of reactive groups on the resin and polyorganosiloxane, the compositions may also include a silane containing an average of more than two hydrolyzable groups per molecule. Preferred compositions develop excellent adhesion to a variety of organic and metallic substrates during curing under ambient conditions.

Method for bonding substrates using molten moisture reactive

Organosiloxane compositions comprising specified combinations of MQ resins and liquid polyorganosiloxanes can be applied as molten materials to form coatings that are non-flowable under ambient conditions and can initially be remelted by heating the coating above its flow transition temperature. In the presence of moisture, the flow transition temperature of the coating gradually increases due to the reaction of hydrolyzable groups on the polyorganosiloxane ingredient until the coating is converted to a non-flowable resin reinforced elastomer. Preferred coatings are non-transferable at 25.degree. C. within ten minutes following application.

Method for coating using molten organosiloxane compositions

Liquid organosilicon compounds containing at least one alkenyl radical per molecule are included as an ingredient of moisture curable organosiloxane compositions containing a liquid polydiorganosiloxane with alkoxysilalkylene terminal units and an organotitanium compound as the curing catalyst. The organosilicon compound reacts with silicon-bonded hydrogen atoms present in said composition, thereby preventing the generation of hydrogen during storage and/or curing of the composition. One source of silicon bonded hydrogen is one of the reactants used to prepare the polydiorganosiloxane.

Moisture curable organosiloxane coating compositions

A moisture-curable silicone composition, suitable for use as a coating or pressure-sensitive adhesive, is disclosed, said composition comprising (i) a hydroxyl-functional organopolysiloxane resin comprising R.sub.3 SiO.sub.1/2 siloxane units and SiO.sub.4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1. respectively, wherein R is a hydrocarbon or halogenated hydrocarbon radical: (ii) a diorganopolysiloxane polymer having at least two silicon-bonded alkoxy groups and at least one carbon-bonded amine group in its molecule, said polymer having a viscosity at 25.degree. C. of 20 to 100,000 centipoise, the weight ratio of said resin to said polymer being in the range 20:80 to 80:20; (iii) optionally, a hydrolyzable silane in sufficient amount to provide stability to said composition; and (iv) optionally, sufficient catalyst to accelerate the cure of said composition.

Moisture-curable compositions containing aminoalkoxy-functional silicone

One part organosiloxane compositions exhibiting long term storage stability under ambient conditions and adhesion at curing temperatures below 120.degree. C. comprise a specified combination of platinum catalyst inhibitors and an adhesion promoting composition consisting essentially of a vinyltrialkoxysilane, an epoxy-substituted alkoxysilane, a vinyl-containing hydroxylated polyorganosiloxane, and a chelated aluminum compound.

One-part curable organosiloxane compositions

The combination of (1) long term storage stability, (2) a relative short cure time at temperatures below about 150.degree. C. and (3) cohesive bonding of the cured elastomer to a variety of substrates is achieved in a one-part organosiloxane composition that cures by a platinum-catalyzed hydrosilylation when the composition includes an acetylenic alcohol containing at least eight carbon atoms as the catalyst inhibitor and, as the adhesion promoter, an alkoxysilane containing an epoxy group and a polyorganosiloxane containing an average of at least one silicon-bonded hydroxyl group and at least one silicon-bonded vinyl radical per molecule. The concentrations of catalyst and adhesion promoter are within specified limits.

Storage stable one-part organosiloxane compositions

Organosiloxane compositions that cure in the presence of ultraviolet radiation comprise a polymethylsiloxane containing a specified combination of mono-, di- and trifunctional siloxane units, an amount of a mercaptoalkyl-substituted polyorganosiloxane or an organic mercaptan in an amount sufficient to cure the composition to a soft, repairable gel and an amount of a photoinitiator sufficient to initiate curing of the composition in the presence of ultraviolet radiation. The cured compositions are particularly useful as coatings and encapsulants to protect electronic devices against the deleterious effects of materials present in the environment adjacent to said devices.

Radiation curable organosiloxane gel compositions

Concentration levels of copper acetylacetonate previously considered ineffective inhibit or eliminate thermally induced hardening of fluorosilicone gels prepared by a hydrosilylation reaction using one-part curable compositions containing an N,N,N',N'-tetraalkyl alkylenediamine as a catalyst inhibitor. This inhibitor can be used alone or in combination with acetylenic alcohols such as methylbutynol to modify the curing characteristics of the composition and/or the properties of the cured gel.

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Midland, MI, United States of America

Bernard Vanwert