Institut Francais Du Pe'trole

Centre D'etude Des Materiaux Organiques Pour Technologies Avancees

Elf France

Other

Centre National De La Recherche Scientifique

Institut Francais Du Petrole, Des Carburants Et Lubrifiants Et

Commissariat a L'energie Atomique

Rhone-progil

Institut Francais Du Petrole, Des Carburants Et Lubrifiants

Societe Elf France

Centre D'etude Des Materiaux Organiques Pour Technologies Avances

Institut Francais Du Petrole, Es Carburants Et Lubrifiants Et Entreprise

Centre D'etudes Des Materiaux Organiques Pour Technologies Avancees

Bernard Sillion

Guy Rabilloud

Choua Cohen

Bernard Damin

Jacques Denis

Robert Leger

Michel Senneron

Paul Maldonado

Sylvain Faure

Paul Mariaggi

R&eacute;gis Mercier

Michel Pineri

Jean Malinge

Pierre Aldebert

Robert Salle

Jacques Garapon

Pierre Le Perchec

Serge Gonzalez

Regis Mercier

Bernard Masson

Alain Forestiere

Jerome Weill

Pierre Giuliani

Gabriel De Gaudemaris

Laurent Germanaud

Jean-Michel Laupie

Gerard Leleu

Jean-Pierre Wauquier

Raymond Boulet

Louis Cuiec

Christian Vacher

Philippe Jost

Sylvain Brunel

Gilbert Parrain

Serge Gonzales

Paul Marriagi

Annie Dussart-Lermusiaux

Bruno Durif-Varambon

Bernard Haemmerle

Durif Durif Varambon

Thierry Pascal

Pierre Bedague

Sulphonated polyimides, membranes prepared with them, and a fuel cell device that includes these membranes

The invention relates to sulphonated polyimides, notably of formula (I)

Sulphonated polyimides, membranes and fuel cell

Polyimide precursor compositions incorporating at least one compound of fula (1), at least one compound of formula (2), at least one compound of formula (3) and at least one compound of formula (4) ##STR1## in which one of the groups R.sup.3 and R.sup.4 represents a hydrogen atom and the other, in the same way as the groups R.sup.1 and R.sup.2, which can be the same or different, in each case represent a hydrocarbon group having 1 to 16 carbon atoms, m is a number between 5 and 20, n is an integer between 1 and 5 and R.sup.5 represents a hydrogen atom, a halogen atom, a hydrocarbon group with 1 to 16 carbon atoms, or a group of formula R.sup.6 --O-- in which R.sup.6 represents a hydrocarbon group having 1 to 16 carbon atoms. The preferred composition contains 30 to 70% by weight of dry matter of compounds of formulas (1), (2) and (3), in which the groups R.sup.1, R.sup.2 and one of the groups R.sup.3 and R.sup.4 is a methyl or ethyl group and the compound of formula (4) is benzyl alcohol. These compositions are usable as smoothing and/or protective coatings for metals, metal alloys or other substrates and in particular in the electrical and electronic industries, e.g. for the formation of dielectric films.

Polyimide precursor composition and application therefrom

Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, one of these diamines consisting of a polyether chain ending with the two amine functional groups and at least an epoxy resin possessing more than one epoxy group per molecular. These adhesive compositions can be used particularly for the gluing of films of polymers to thin metal sheets.

Method of gluing substrates using a composition comprising an

Thermosetting Schiff base resins, their preparation and their applications re described. These thermosetting Schiff base resins can be defined as responding to the general formula: ##STR1## Radicals Ar.sub.1, Ar.sub.2 and Ar.sub.3 are chosen so that the softening temperature of the resins is less than about 150.degree. C. The resins can be prepared by direct condensation of an ethynyl benzaldehyde or acetophenone on a telechelic diamine oligomer obtained by reaction of a diamine containing flexibilizing groups on a derivative of benzhydrol tetracarboxylic acid. These Schiff base resins can be used by bulk thermal polymerization particularly to prepare adhesives or composite matrices.

Thermosetting polyimide schiff base resins, their preparation and their

Expanded material obtained by heating a composition comprising at least one hermosetting nadimide resin, said heating being performed at a temperature and during a period which are sufficient to cause the expansion of said composition by release of cyclopentadiene. A nadimide resin of the polyimide type and having a number average molecular weight of 600 to 10,000 is preferably used. The composition further comprises preferably 1% to 50% by weight of a linear, preferably thermostable polymer.

Expanded materials with nadimide resin base

Polymer compositions comprising poly(benzhydrolimide) chains ending with ethylenic unsaturated groups complying with the general formula: ##STR1## wherein Ar is a divalent aromatic radical and R a hydrogen atom or a monovalent hydrocarbon radical. They can be prepared by reacting, under imidation condition, at least one primary diamine with at least one benzydrol 3,3', 4,4'-tetracarboxylic acid, a bis (ortho-acid-ester) or a tetraester of such acid and with an anhydride, an acid-ester or a diester of dicarboxylic cycloaliphatic acid with ethylenic unsaturation. These compositions may be converted to cross-linked polymides by thermal polyemrization. They can be used in particular for manufacturing composite materials, adhesives, molded articles and protective coatings withstanding high temperatures.

Polybenzhydrol compositions ending with ethylenic unsaturated groups,

Thermosetting quinazolone resins, their preparation and their applications re described. These thermosetting quinazolone resins can be defined as having the following general formula: ##STR1## in which Ar.sup.1 is a bivalent mono- or polycyclic aromatic radical and Ar.sup.2 is a bivalent aromatic radical of several simple aromatic rings bound two by two by atoms or bivalent groups. These Ar.sup.1 and Ar.sup.2 radicals are chosen so that the melting or emollescence temperature is between 80.degree. C. and 170.degree. C. The resins can be prepared from condensation of an ethynylarylbenzoxazinone with an aromatic diamine containing flexibilizing groups. These quinazolone resins can be polymerized in bulk in order to prepare adhesives or composite matrices in particular.

Thermosetting quinazolone resins their preparation and their applications

Copolymers of average number molecular weight from about 300 to 5,000 comprising recurrent units originating (A) from alpha olefins, (B) from .alpha.,.beta. unsaturated .alpha., .gamma. dicarboxylic compounds, (C) from unsaturated acid esters of 1,2-diols, optionally etherified or esterified, and (D) optionally from acrylic esters, the proportions of the recurrent units being 5-60% for (A), 10-70% for (B), 10-60% for (C) and 0-60% for (D), at least one of recurrent units (A), (B) and/or (C) comprising at least 12 carbon atoms, and at least 10% of the recurrent units of said copolymer being (B) recurrent units of N-substituted imide type. These copolymers form additives useful to lower the pour point of middle distillates, particularly of gas-oils. The use of said additives at a concentration from 0.001 to 2% by weight results in a substantial decrease of the pour point of the treated middle distillates.

Nitrogenous copolymers, their preparation and use as additives for

Oligomer compositions of polyaryloxypyridine with acetylenic end groups are btained by formation of an oligomer composition of polyaryloxypyridine with halogenated end groups from an alkaline diphenolate and a dihalogenopyridine, followed with an ethynylation reaction. The average polycondensation degree may range from 1 to 50. Theses compositions can be used to form cross-linked lattices by polyaddition of the ethynyl groups.

Oligomer compositions of polyaryloxypyridines with acetylenic end

The disclosed compositions of polyaryloxypyridine oligomers with phthalonile end groups are obtained by formation of a composition of polyaryloxypyridine oligomers with alkali phenolate end groups, followed with the reaction of said composition with 4-nitrophthalonitrile. Their average polycondensation degree may range from 1 to 50. They can be used in combination with a co-reactant derived from benzhydrol and containing one or two ortho-dinitrile functional groups, to constitute polyaryloxypyridine co-polyphthalocyanine lattices.

Compositions of polyaryloxypyridine oligomers with phthalonitrile end

Aromatic polyimide compositions, useful in particular for manufacturing adhesive materials, varnishes and films withstanding high temperatures, having a high solubility in organic solvents, particularly polar solvents and which are manufactured by reacting, in such a solvent, a tetraester or diacid-diester of benzhydrol 3,3', 4, 4' tetracarboxylic acid with an aromatic diamine for a sufficient time to obtain a polycondensation reaction product having an inherent viscosity at 30.degree. C., at a concentration of 5 g/liter in N-methyl pyrrolidone, ranging from 0.1 to 2 dl/g.

Aromatic polyimide compositions of high solubility and their uses

Copolymers with nitrogen groups are used as additives to lower the cloud point and improve the filterability limit temperature and the pour point of middle distillates such as gas oils. They are obtained by reacting a compound having a primary amine group with a copolymer comprising 15 to 40% of recurrent units form a linear .alpha.-olefin, 20 to 70% of recurrent units form and .alpha.,.beta.-unsaturated dicarboxylic compound and 15 to 45% of recurrent units form an alkyl ester of unsaturated monocarboxylic acid.

Nitrogen containing copolymers useful as additives for lowering the

Polyimide precursor compositions are described which may be prepared by rting a biprimary aromatic diamine with a diester-diacid or an aromatic tetraacid, and then with the substantially stoichiometrical complement of an aromatic dianhydride. The polyimide precursor compositions are used in the manufacture of insulating coatings, films, impregnating or enamelling varnishes for electric wires etc., and have excellent qualities of flexibility, adhesiveness and heat resistance.

Polyimide precursor compositions, their manufacture, the resultant

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Lyons, France

Bernard Sillion