Sarnoff Corporation

Lamina Ceramics, Inc.

Sharp Kabushiki Kaisha Corporation

Renesas Technology America, Inc.

Mitsubishi Electric and Electronics U.s.a., Inc.

Lamina Ceramics, in

Bernard Dov Geller

Barry Jay Thaler

Aly Eid Fathy

Ellen Schwartz Tormey

Stewart Mark Perlow

Arye Rosen

Michael James Liberatore

Leszek Hozer

Mark Stuart Hammond

Hung-tse Daniel Chen

Gerard Frederickson

Attiganal Narayanswamy Sreeram

Glen C Metheny

Ananda H Kumar

Ashok Narayan Prabhu

Ashok Naryan Prabhu

Israel Haim Kalish

Henry Charles Johnson

Valerie Ann Pendrick

Daniel Shaw

Zygmond Turski

Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.

High performance embedded RF filters

A method and system are described for monitoring a deliverable radio frequency (RF) power of an amplifier operable on a monolithic microwave integrated circuit (MMIC). According to an exemplary embodiment, circuitry is configured to capture, on the MMIC, a first portion of an RF signal transmitted from the amplifier to a load, and a second portion of the RF signal reflected from the load back to the amplifier. Circuitry is also configured to generate, on the MMIC, a first signal proportional to an RF power of the first portion of the RF signal, and a second signal proportional to an RF power of the second portion of the RF signal. Additional circuitry is configured to subtract a first reference signal from the first signal to produce a third signal, and a second reference signal from the second signal to produce a fourth signal. Finally, circuitry is configured to subtract the fourth signal from the third signal to produce an output signal proportional to the deliverable RF power of the amplifier to the load.

Method and system for monitoring a deliverable radio frequency power of an amplifier operable on a monolithic microwave integrated circuit

A system for impedance matched switching of an input signal from an input source includes a first switch, such as an FET, for controllably switching the input signal from an input terminal connected to the input source to an output terminal, the switching being controlled according to a control voltage. The system further includes a second switch, such as an FET, for controllably switching a matching impedance between the input terminal and ground according to the control voltage. When the input signal is prevented from passing from the input terminal to the output terminal by the first switch, the input signal passes through the matching impedance, which has an impedance characteristic substantially matched to an impedance characteristic of the input source.

Method and system for impedance matched switching

A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate

A dual-directional coupler for measuring true RF power apparent at a radiating element. Incident and reflected power are detected by a pair of detectors. The difference between the two detected voltages is amplified by a differential amplifier to generate a voltage proportional to the true transmitted power.

Method and apparatus for measuring true transmitted power using a broadband dual directional coupler

Ceramic multilayer circuit boards mounted on a patterned metal support substrate

A switch matrix comprising a mulitlayer ceramic circuit board having a M&times;N array of N&times;N switch modules. Specifically, the ceramic circuit board has a M&times;N array of mounting sites for accepting individual N&times;N switch modules. The ceramic circuit board contains all the necessary interconnects to form a M&times;N RF switch matrix.

Integrated RF M&times;N switch matrix

An array antenna includes a first ceramic layer and a second ceramic layer. A metal layer is disposed between the first and second ceramic layers. A plurality of radiating elements are mounted on the first ceramic layer, and a plurality of control circuits are mounted on the second ceramic layer. The control circuits are coupled to the radiating elements through a plurality of conductive vias which feed through the metal layer. The array antenna may also include a switch having a plurality of poles formed in the second ceramic layer and coupled to one of the radiating elements through one or more conductive vias. A plurality of phase delay elements may be coupled at a first end to a signal source and coupled at a second end to the respective plurality of poles of the switch to provide phase-delayed signals. A waveguide may also be formed within the ceramic layers. Conductive vias or coaxial transmission lines may be used to connect elements within the array antenna.

Switch structure for antennas formed on multilayer ceramic substrates

Antennas formed using multilayer ceramic substrates

An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a conductive material having on a surface thereof a body of a dielectric material. The dielectric body is formed of a plurality of layers of the dielectric material bonded together. A plurality of strips of a conductive material are on the surfaces of the layers of the body to form RF, analog and digital components. Discrete electronic devices are mounted on the body and connected in the circuit. Vias of a conductive material extend through the various layers of the body to electrically connect the various strips of conductive material on the layers of the body.

Integrated electronic circuit

A package for an electronic component includes a metal base plate and a body of an insulating material, such as glass or ceramic, on and bonded to a surface of the base plate. The body is formed of a plurality of layers of the insulating material stacked and bonded to each other and has at least one opening extending therethrough to the base plate. Strips of a conductive material, such as a metal, are on the surface of various layers of the body. An electronic component is mounted in the opening in the body and has terminals which are electrically connected to the conductive strips on the body, preferably by wires. Vias of a conductive material may extend through some of the layers of the body to connect the conductive strips to terminals on the surface of the body. A cover plate of an insulating material may extend over the body and the opening therein to enclose the electronic component in the body.

Electronic circuit chip package

Growing community of inventors

Princeton, NJ, United States of America

Bernard Dov Geller