Smart Packaging Solutions

Smart Packing Solutions

Bernard Calvas

Benjamin Mear

Guillaume Gerin

Kevin Fabrizio

Deborah Teboul

François Dauphin

Pierre Volpe

Didier Livrati

Philippe Castano

Katia Leiva

A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object is provided. The process includes at least the following steps: Also provided is a module obtained by means of the process.

Electronic module for chip card

An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.

Electronic module with optimized antenna for smart cards with a dual communication interfaces

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Rousset, France

Bernard Calvas