Gemplus

Bernard Calvas

Philippe Patrice

Didier Elbaz

Jean-Christophe Fidalgo

Olivier Brunet

Michel Chomette

An adapter electrically connects an integrated circuit mini-card in a main electronic integrated circuit memory card connector having greater space requirement than the mini-card. The mini-card has surface contact strips and the adapter includes a main body capable of being connected to the main connector and a housing for receiving the mini-card at the surface of the main body. The housing includes inside bond pads for connection to the electric contacts of the mini-card. A mobile cover is capable of taking up a position wherein it closes at least partly the housing while maintaining the mini-card in electrically connecting position in the housing and stiffening the structure of the adapter.

Adapter for electrically connecting a miniature integrated circuit card in a memory card connector

A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a bump contact in weldable material. The bump contact has a welding surface in the same plane as at least one of the chip faces. An interconnection pad is provided on the support that is designed to be welded with a corresponding bump contact of the chip. The welding face of each bump contact of the chip is placed opposite each corresponding interconnection pad of the support. Each bump contact of the chip is welded with each corresponding interconnection pad of the support. The method can be applied to a device such as a chip card.

Device and method for making devices comprising at least a chip fixed on a support

The invention concerns a method for protecting integrated circuit chips of a silicon wafer. The silicon wafer is cut so as to disengage the chips from the integrated circuit; and a fluid insulating material is applied on the rear surface of the wafer so as to coat the flanks of each chip of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips where the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.

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Aubagne, France

Bernard Calvas