Compagnie Internationale Pour L'informatique Cii-honeywell Bull (societe

Compagnie Internationale Pour L'informatique Cii-honeywell Bull

Bernard Badet

Karel Kurzweil

Francois Guillaume

Yves Dekeyser

An interconnecting substrate according to the invention comprises an insulating base on which rests a set of alternating, superimposed conductive and insulating layers. Contacts are formed on the uppermost insulating layer which border at least one site or zone intended for an integrated circuit chip device whose output conductors are to be connected to the said contacts. Through-connections enable the contacts to be coupled to one of the inner conductive layers. The through-connections include at least one through-connection on the inside of the site relative to at least a predetermined one of the said contacts. A shunt conductor means connected to the predetermined contact has a part outside the site which is connected to an additional contact which serves as a substitute or replaces the said predetermined contact for the connection to the associated output conductor of the chip device. The repair arrangement according to the invention allows one to substitute for a connection inside a site over which a chip is situated between a contact and a through-connection, a link which has a part outside the site from which it is possible to make a repair or modification of the circuit function without the need to remove the component. The repair arrangement is made up of conductive and insulating layers which are deposited at least locally on the substrate.

Substrate for interconnecting electronic integrated circuit components

A tensioning device for materials of tape form particularly adapted for metic printers and comprises a floating element situated between free sections of a paper tape installed in return fashion in a driving mechanism. The floating element is provided with displacement transmission elements formed by spiked belts of which the spikes are engaged in perforations in the tape. The tensioning of the tape is provided by a weight hooked to the floating element such that the tape section emerging from the driving mechanism is driven, via the floating element, by the tape section which enters the driving mechanism.

Tensioning device for materials of tape form

A standardized access card is formed of a single or a pair of bonded sheets f material including a cavity within which is disposed an integrated circuit assembly for processing electrical signals arranged within the card. The thickness of the assembly is relatively smaller than the thickness of the card and terminal areas of the assembly are accessible through cut-outs in the card which may be open or plugged with conductive material. The card may be formed in a continuous process from a plurality of strips of material which separately provide the card material, the integrated circuit assembly and a cover for the device of the circuit assembly.

Standardized information card

A standardized access card is formed of a single or a pair of bonded sheets of material including a cavity within which is disposed an integrated circuit assembly for processing electrical signals arranged within the card. The thickness of the assembly is relatively smaller than the thickness of the card and terminal areas of the assembly are accessible through cut-outs in the card which may be open or plugged with conductive material. The card may be formed in a continuous process from a plurality of strips of material which separately provide the card material, the integrated circuit assembly and a cover for the device of the circuit assembly.

Growing community of inventors

Belfort, France

Bernard Badet