Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Bernard A Meyer

Andrew Zachary Glovatsky

Jay DeAvis Baker

Myron Lemecha

Richard Keith McMillan

Lawrence LeRoy Kneisel

Zhong-You Joe Shi

Lakhi Nandlal Goenka

John Trublowski

Peter Joseph Sinkunas

Paul E Stevenson

Harvinder Singh

Wells L Green

Debojit Barua

Kenneth A Salisbury

Richard K McMillan, Ii

David James Steinert

Rexanne M Coyner

Thomas B Merala

Matti Mikkor

An antenna system for receiving communication signals from satellites having plurality of subplates, a plurality of antenna nodes supported on the top surface of each subplate, and an electronic control unit to which the subplates are fixed and aligned and a collapsible support stand fixed to the bottom of the electronic control unit opposite the subplates in which the subplates, electronic control unit and stand interconnect to form an easily assembled lightweight antenna assembly that may be disassembled into easily portable components.

Light weight portable phased array antenna

An integrated LCC-based strain gage sensor, in which at least two LCC traces or strands run across a microcavity within the cylinder head gasket. In one aspect of the present invention, a system is provided comprising a signal source and a microcavity through which an input signal from the signal source passes and which alters the input signal as a result of a response of the microcavity to a strain. An LCC connects the microcavity and the signal source and an input signal propagates through the LCC. The microcavity may comprise one or more reflective surfaces which alters the input signal as a result of a change in a dimension of the microcavity. In another aspect of the invention, the microcavity produces an output signal that has an intensity or frequency different from that of the input signal upon undergoing a deformation.

LCC-based strain-gage sensor integrated with cylinder-head gasket

An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.

Optically controlled IPCS circuitry

There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component,having at least two terminations thereon; a dielectric substrate,having a first surface,on a first side thereof, a second surface on a second side thereof, and at least two mounting pads,arranged on the first surface,in matched relation with the terminations of the electronic component,; and a diode laser,; (b) depositing solder paste atop the mounting pads,; (c) placing the electronic component,atop the substrate,such that each termination rests generally atop its respective mounting pad,; and (d) directing laser energy,from the diode laser,to at least one of the mounting pads,from the second side of the substrate,for a predetermined time, such that the solder paste atop the at least one of the mounting pads,is melted.

Method for laser soldering a three dimensional component

There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

Laser-solderable electronic component

A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.

Micro soldering system for electronic components

Growing community of inventors

Taylor, MI, United States of America

Bernard A Meyer