Abb Research Ltd.

Berk Yesin

Bruno Agostini

Francesco Agostini

Thomas Gradinger

Slavo Kicin

Christoph Haederli

Hamit Duran

Matti Kauhanen

Chunlei Liu

Jose Balta

Mervi Jylhakallio

An exemplary heat exchanger is configured for removing heat energy from a heat generator. The heat exchanger including at least one conduit for a working fluid, which is arranged in an upright position of at least 45&#xb0;, each conduit having an exterior wall and at least one interior wall for forming at least one evaporator channel and at least one condenser channel within the conduit. Furthermore, the heat exchanger includes a first heat transfer element for transferring heat into the evaporator channel and a second heat transfer element for transferring heat out of the condenser channel.

Heat exchanger

A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.

Cooling module for cooling electronic components

An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.

Evaporator and cooling circuit

A power-electronic arrangement comprising semiconductor components (), a heat exchanger (), and an electrically conductive element () is presented. The heat exchanger comprises evaporator channels () and condenser channels () for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.

Power-electronic arrangement

An evaporator is disclosed for a cooling circuit. The evaporator includes a housing having at least one wall for contacting a heat emitting device. A channel, the cross section of which is small enough to allow convection boiling, and a separation volume are located in the evaporator. The separation volume is located at a vapor exiting port of the channel. The evaporator can include a liquid reservoir.

Evaporator for a cooling circuit

The disclosure relates to a two-phase cooling circuit. The cooling circuit can include an evaporator and a condenser. The evaporator and condenser can be connected by a feeder line and a first return line. A phase separator is arranged at an inlet side of the condenser. The phase separator can be connected with the evaporator by a second return line.

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Zurich, Switzerland

Berk Yesin