Samsung Electro-Mechanics Co., Ltd.

Beomjoon Cho

Gyeong Ju Song

Won Young Jang

Seungmin Ahn

Younghun Lee

Jihong Jo

Hyeok Jin Park

Mina Hyun

An electronic component includes: a first capacitor; and at least one second capacitor that is disposed on the first capacitor along a stacking direction. Each of the first capacitor and the second capacitor includes a dielectric layer and a plurality of internal electrodes spaced apart from each other with the dielectric layer interposed therebetween and disposed in the stacking direction. A distance between the plurality of internal electrodes according to the stacking direction in the first capacitor is greater than a distance between the plurality of internal electrodes according to the stacking direction in the second capacitor.

Electronic component

An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, a frame terminal disposed on the external electrode, and a conductive bonding portion disposed between the external electrode and the frame terminal. The frame terminal has a groove portion extending along an outer periphery of an area in contact with the conductive bonding portion.

An electronic component according to an embodiment including a conductive bonding portion disposed between an external electrode and a frame terminal, and a non-conductive material layer disposed on a band portion of the external electrode. The external electrode may also have a connection portion covering one surface of a body of the electronic component.

An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, and a frame terminal having a supporting portion disposed on the external electrode, and a mounting portion disposed at one end of the supporting portion. The supporting portion has a concave portion spaced apart from the mounting portion and having a distance to the mounting portion less than a distance from the capacitor boy to the mounting portion.

An electronic component according to an embodiment includes a multilayer capacitor, a frame terminal, and a conductive bonding portion. An area in which the conductive bonding portion contacts the frame terminal is larger than an area in which it contacts with the external electrode.

Growing community of inventors

Suwon-si, South Korea

Beomjoon Cho