Nuvoton Technology Corporation

Benny Shatit

Ming-Che Hung

Tsung-Hsueh Li

Uri Trichter

Dan Morav

Lior Albaz

An integrated circuit (IC) is provided. The IC includes a molding compound, a plurality of pins, an exposed pad, a die surrounded by the molding compound, an adhesive material, and a plurality of bonding wires. The pins are disposed on at least one edge of the molding compound and separated from each other. The adhesive material is disposed between the die and the exposed pad and surrounded by the molding compound. The exposed pad is electrically connected to the die through one of the bonding wires, and the pins are electrically connected to the die through the remaining bonding wires. The die is configured to detect whether a chassis intrusion event is present in response to a signal from the exposed pad.

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Hsinchu, Taiwan

Benny Shatit