Hewlett-packard Development Company, L.p.

Benjiman White

William Edward Hertling

Mike Whitmarsh

Shih Chuan Huang

Hsin Wen Hsu

Chih Sheng Liao

Yu Cheng Wu

According to one aspect, there is provided a method of forming a layer of build material on a build platform of a three-dimensional printing system. The method comprises obtaining characteristics of a build volume to be processed, determining characteristics of a volume of build material to be used to form the layer, forming an intermediate volume of build material having the determined characteristics, and spreading the intermediate volume of build material over the build platform to form the layer.

Forming layers of build material of a three-dimensional printing system

Example implementations relate to computing devices with movable input/output (I/O) connectors. For example, a computing device may include a chassis of the computing device and an I/O connector to connect an I/O device to the computing device. The I/O connector may be movable about an axis relative to the chassis by at least 180 degrees such that the I/O connector is accessible from multiple sides of the chassis.

Computing devices with movable input/output connectors

An example unmanned aerial vehicle includes an electromagnetic radiation (EMR) sensor. The EMR sensor detects a signal indicative of a substance to print. The unmanned aerial vehicle also includes a nozzle to eject the substance based on a location at which the signal is detected.

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Vancouver, WA, United States of America

Benjiman White