Lam Research Corporation

Benjamin W Mooring

Andrew D Bailey, Iii

Nicolas J Bright

Richard M Blank

Peter S Thaulad

Candi Kristoffersen

Brett Herzig

Yezdi N Dordi

John Boyd

Fritz C Redeker

Aleksander Owczarz

Arthur M Howald

Alan M Schoepp

Richard Howard Gould

Carl Woods

Hyungsuk Alexander Yoon

David J Hemker

William Thie

John P Parks

Jack Chen

Damon Tyrone Genetti

Tony Ray Kroeker

Tiruchirapalli Arunagiri

James S Van Gogh

Scott Vernon Wong

Chung Ho Huang

Gustavo G Francken

Charles Freund

Jeffrey Lin

Michael Leonard

Charles W Freund

Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.

Enhanced automatic wafer centering system and techniques for same

Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot are discussed. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.

Each sensor in an array of sensors detects and signals when an edge of a wafer passes by the sensor on a wafer handling component of a robot. A number (N) of detected wafer edge locations is determined. Each detected wafer edge location is a set of coordinates (x, y) in a coordinate system of the wafer handling component. For each unique set of (N&#x2212;1) of the number (N) of detected wafer edge locations, an estimated wafer offset is determined that substantially minimizes a performance index value. The estimated wafer offset is a vector extending from a center of the coordinate system of the wafer handling component to an estimated center location of the wafer. A final wafer offset is identified as the estimated wafer offset that has a smallest corresponding performance index value. The final wafer offset is used to center the wafer at a target station.

Fiducial-filtering automatic wafer centering process and associated system

A loading station for a substrate processing system includes first and second vertically-stacked loading stations. The first loading station includes a first airlock volume and first and second valves arranged at respective ends of the first loading station. The first and second valves are configured to selectively provide access to the first airlock volume and include first and second actuators, respectively, configured to open and close the first and second valves, and the first and second actuators extend downward from the first loading station. The second loading station includes a second airlock volume and third and fourth valves arranged at respective ends of the second loading station. The third and fourth valves are configured to selectively provide access to the second airlock volume and include third and fourth actuators, respectively, configured to open and close the third and fourth valves.

Platform architecture to improve system productivity

A system including a first linear bearing, a second linear bearing, a first shuttle, and a second shuttle. The first linear bearing is mounted in and disposed along a linear path of a transfer chamber. The second linear bearing is mounted on a same side of the transfer chamber as the first linear bearing and disposed along the linear path. The first shuttle rides on the first linear bearing and carries a first wafer. The second shuttle rides on the second linear bearing and carries a second wafer. The second shuttle moves independent of the first shuttle. During movement of the first shuttle and the second shuttle and during a first period of time, a first portion of the second shuttle is above the first shuttle such that the first portion of the second shuttle is vertically overlapping the first shuttle. During movement of the first shuttle and the second shuttle and during a second period of time, the first portion of the second shuttle is not above the first shuttle such that the first portion of the second shuttle is not vertically overlapping the first shuttle.

Method and system related to semiconductor processing equipment

Semiconductor processing equipment. At least some of the illustrative embodiments are systems including: a front end robot configured to pull individual wafers from at least one wafer carrier; a linear robot in operational relationship to the front end robot, the linear robot configured to move wafers along an extended length path; and a first processing cluster in operational relationship to the linear robot. The first processing cluster may include: a first processing chamber; a second processing chamber; and a first cluster robot disposed between the first and second processing chambers. The first cluster robot is configured to transfer wafers from the linear robot to the processing chambers, and configured to transfer wafers from the processing chambers to the linear robot.

A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions.

Controlled ambient system for interface engineering

Methods and systems to optimize wafer placement repeatability in semiconductor manufacturing equipment using a controlled series of wafer movements are provided. In one embodiment, a preliminary station calibration is performed to teach a robot position for each station interfaced to facets of a vacuum transfer module used in semiconductor manufacturing. The method also calibrates the system to obtain compensation parameters that take into account the station where the wafer is to be placed, position of sensors in each facet, and offsets derived from performing extend and retract operations of a robot arm. In another embodiment where the robot includes two arms, the method calibrates the system to compensate for differences derived from using one arm or the other. During manufacturing, the wafers are placed in the different stations using the compensation parameters.

Dynamic alignment of wafers using compensation values obtained through a series of wafer movements

A method of determining an average electrical response to a conductive layer on a set of substrates vibrating about a vibration mean is disclosed. The method includes positioning a sensor near a position on a first substrate; and measuring a first plurality of electrical responses, wherein each of the first plurality of electrical responses is function of an electrical film property response and a first substrate proximity response. The method also includes positioning the sensor near the position on a second substrate; and measuring a second plurality of electrical responses, wherein each of the second plurality of electrical responses is function of the electrical film property response and a second substrate proximity response. The method further includes determining a first average electrical response for the first substrate and a second average electrical response for the second substrate, wherein a difference between an average first substrate proximity response and an average second substrate proximity response is about zero.

Methods and apparatus for determining an average electrical response to a conductive layer on a substrate

Dynamic alignment of a wafer with a blade that carries the wafer involves determination of an approximate value of wafer offset with respect to a desired location of the wafer in a module. This determination is made using an optimization program. The wafer is picked up from a first location using an end effector that transfers the picked up wafer from the first location past sensors to produce sensor data. For an unknown wafer offset, the picked up wafer is misaligned with respect to a desired position of the picked up wafer on the end effector. When the desired position does not correspond to original target coordinates to which the end effector normally moves, the original target coordinates are modified to compensate for the approximate value of the offset and the picked up wafer is placed at the modified target coordinates to compensate for the unknown offset and the misalignment.

Method and apparatus for determining substrate offset using optimization techniques

A wafer is transported on a blade of a robot along a path through a port into a module of semiconductor manufacturing equipment. The port has a transverse axis intersecting the path. Dynamic alignment uses two through-beam sensors positioned along the transverse axis to determine the position of the center of the wafer with respect to the center of the blade as the wafer is transported. Positioning of the sensors according to latency characteristics of the sensors assures that the moving wafer will break or make a beam of a first of the sensors and that the first sensor will generate a first transition signal before the moving wafer will break or make a beam of a second of the sensors and before the second sensor generates a second transition signal. The dynamic alignment may be performed with respect to wafers having different sizes.

Method of and apparatus for dynamic alignment of substrates

An interlocked control system is provided for dual sided slot valves contained in a vacuum body between each of a plurality of adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. Under control of the system, the valve may allow separate operation of the transport module and certain ones of the process modules, while a selected one of the process modules is in either a maintenance state or a locked out state for servicing. The system includes a separate controller for the transport module and a separate controllers for the process modules. A control interface coordinates the flow of signals between the controllers and local devices, and system user interfaces provide inputs to the control system from operational and service personnel.

Semiconductor processing platform architecture having processing module isolation capabilities

A dual sided slot valve is in a vacuum body between adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. The valve allows access to an open valve for servicing the open valve in that one actuator motor stops the valve in an open, but not vertically-spaced, position relative to the respective slot. The open valve is more easily reached by a gloved hand of a service worker. A separate actuator motor moves the valve vertically down from the open position and away from the slot to expose the sealing surface around the slot for cleaning. The vertical distance of the vertically-moved valve from an access opening makes it difficult for the worker's glove to reach the valve for service. However, in the vertically-moved position the valve does not interfere with the ability to clean around the valve door. The dual sided slot valves are offset relative to each other to reduce the distance occupied by the valve body between the adjacent transport and process modules.

Growing community of inventors

Cedar Park, TX, United States of America

Benjamin W Mooring