Anaren, Inc.

Benjamin Shawley

Michael Enders

Benton O'Neil

Adam Cook

The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.

Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer

An assembly includes at least one first microstrip network having at least one first transmission line disposed on a first surface of a first dielectric layer including a first ground plane disposed on a second surface of the dielectric layer. At least one second microstrip network includes at least one second transmission line disposed on a first surface of a second dielectric layer, the second dielectric layer including a second ground plane disposed on a second surface of the second dielectric layer. The at least one second microstrip network is inverted relative to the at least one first microstrip network. At least one integrated support and shielding (ISS) structure is disposed between the second and the first microstrip network. The ISS structure includes a first cavity accommodating the first microstrip network and a second cavity accommodating the second microstrip network. The cavities are configured in accordance with RF performance criterions.

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Chittenango, NY, United States of America

Benjamin Shawley