International Business Machines Corporation

Benjamin R Bayat

Frances S Clougherty

James George Michael

Raymond Patrick Mallette

Kathleen G Purdy

A method and system sorts manufactured integrated circuit devices by evaluating performance characteristics of the manufactured integrated circuit devices. All of the integrated circuit devices are manufactured using an identical design, and differences in the performance characteristics among the integrated circuit devices occurs because of variations including manufacturing line variations. The integrated circuit devices are sorted into groups according to the performance characteristics and are utilized in different computing devices depending upon individual performance requirements of the computing devices.

Allocating manufactured devices according to customer specifications

A yield expectation determination is dynamically provided during manufacturing of a lot of integrated circuits. In one embodiment, the determination includes initially establishing a yield expectation for a lot, which can be based on a process grade, and adjusting the yield expectation during manufacturing based on test data from the kerf of a wafer. In addition, the yield expectation can be adjusted based on inspection data from optical and SEM inspection tools during manufacturing. Correlation coefficient models that correlate kerf data and inspection data to a yield expectation adjustment are used to dynamically adjust the yield expectation, resulting in a more accurate yield projection during manufacturing. The correlation coefficient models and/or process grade estimates are updated based on actual yield from a previous lot, thus further improving yield expectation accuracy.

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Williston, VT, United States of America

Benjamin R Bayat