Infineon Technologies Ag

Finisar Corporation

Benjamin Prodinger

Werner Kuhlmann

Melanie Ring

Oliver Stier

Daniel Reznik

Nicola Iwanowski

An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (), applied to an aluminum contact surface () of the silicon support (), by means of a deposition method. The aluminum contact surface () is located on a landing pad () on the silicon support ().

Mounting and adhesive layer for semiconductor components

An optical transmitting and/or receiving device has a semiconductor component with a first contact for connecting to a reference voltage and a second contact for obtaining or supplying a high-frequency electrical signal. There is also an electrically conducting carrier substrate with a first surface and a second surface. The semiconductor component is configured on the first surface of the carrier substrate. The second surface of the carrier substrate has a metallization that can be connected to a reference voltage applied by an electrical path through the carrier substrate to a first contacting region of the first surface of the carrier substrate. The first contact of the semiconductor component is electrically connected to the first contacting region.

Optical transmission and/or receiving device

Growing community of inventors

Wernberg, Austria

Benjamin Prodinger