Microsoft Technology Licensing, LLC

Benjamin Patrick Sullivan

James David Holbery

Siyuan Ma

Kelly Marie Bogan

Collin Alexander Ladd

Don Pasindu Vijai Lugoda

David Michael Lane

Thomas Joseph Longo

Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.

Mapping temperatures across a surface

Examples are disclosed herein that relate to electronically functional textile articles. One example provides a knitted textile article comprising a first conductive thread and a second conductive thread knit into the article in such a manner as to form a conductive junction separated by a gap. The knitted textile article further comprises a knitted surface texture feature formed at a location that defines an opening over the gap, and an electronic component connecting the gap to form a circuit with the first conductive thread and the second conductive thread.

Electronic functionality in textiles

User expectations demand that keypad layout and size, as well as keypad performance and illumination remain the same or improve over time. In various implementations, the keyboards disclosed and detailed herein incorporate an array of thermoset bare die light emitting diodes in an effort to more evenly distribute light through a keyboard structure without increasing keyboard thickness, as compared to prior art designs.

Multi-stage cure bare die light emitting diode

Examples are disclosed that relate to electronically functional yarns. One example provides an electronically functional yarn comprising a core, a sheath at least partially surrounding the core, and an electronic circuit formed on the core. The circuit includes three or more control lines and more than three diode-containing circuit elements controllable by the three or more control lines, each circuit element being controllable via a corresponding set of two of the three or more control lines.

Electronically functional yarn

Examples disclosed herein relate to using optical fibers in a textile to channel light from a light source to various exit locations within the textile. One example provides an optical device, comprising a light source, an optical fiber extending from the light source, the optical fiber configured to conduct light received from the light source via internal reflection, and a plurality of individually controllable light-emitting locations disposed along the optical fiber.

Light-emitting textile with optical fibers

As mobile computing devices are increasingly expected to be smaller, thinner, and/or lighter, less space is available for incorporating such structurally stiff perimeter components, as well as energy-absorbing components. The electroactive perimeter stiffening devices, systems, and methods described herein detect a free-fall event or condition, anticipate a subsequent impact event, and actively stiffen one or more electroactive perimeter stiffeners of an associated mobile computing device in preparation for the impact event. The electroactive perimeter stiffeners direct impact energy away from, and in some cases, distribute and/or dissipate the impact energy, in an effort to prevent damage to impact-sensitive components of the mobile computing device.

Electroactive perimeter stiffener

An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.

Growing community of inventors

Redmond, WA, United States of America

Benjamin Patrick Sullivan