Other

Tyco Electronics Corporation

Fiber Instrument Sales

Benjamin Lee Sitler

Frank Giotto

Robert H Reamey

Paul G Schoenstein

Christine Ellen Vogdes

Raymond Joseph Wertz

James E Hisert

Arthur James Hoffman, Iii

Murray Joseph Selwyn Kirshtein

Scott Van Rixel

Woods Gebbia

Richard Borowiec

Ray Wertz

Justin Lee Stevens

Justin Stevens

Dan Convertino Convertino

Murray J S Kirshtrin

A security cover system and apparatus for beverage cans and other containers. The system includes a security cap that is installed upon the top of an unopened container for containing an adult beverage or the like. The cap is adapted for secure installation upon the top of a container having a top with a circumferential rim, such as an aluminum beverage can. The cap has catches engagable with the rim of the container. The system includes an opener tool with a specially shaped key portion thereon. The opener engages with a complementary slot in the cap to permit an authorized person, using the opener tool, to remove the cap from the container.

Security cover for beverage cans and other containers

There is provided an adapter that fits most standardized fiber optic cable connectors to allow quick field installations. The adapter includes a split diameter. The smaller diameter fits within a rear back shell of the connector and receives a fiber stub from the connector. The larger diameter abuts the rear of the rear back shell and receives an optical fiber. The adapter includes a pair of mated resilient members that forms a fiber guide within the adapter. The fiber stub and a bare optical fiber of the optical fiber are optically spliced within the fiber guide formed within the resilient members.

Universal adapter for fiber optic connectors

There is provided an apparatus that determines the location of an impermissible tamper on an object, such as an impermissible attempt to gain access to a manhole system or an attempt to steal a work of art, includes a housing disposed adjacently to the object. A fiber optic cable runs through the housing. The object includes a portion that cooperates with internal components of the housing to maintain the fiber optic cable in a non-attenuated state. Upon the impermissible tamper, that portion of the object no longer cooperates with the internal components of the housing. An elastic force internal to the housing cooperates with more internal housing components to create a microbend to the fiber optic cable. Using known optical time domain reflectometer technology, the location of the microbend along the fiber optic cable is readily discerned.

Fiber optic cable sensor for movable objects

There is provided an electronic security system for a perimeter structure that incorporates a fiber optic cable secured to the perimeter structure. Typically the perimeter structure is a fence. A light pulse is transmitted down the fiber optic cable. Mechanical attenuation devices disposed at various locations along the fiber optic cable are responsive to intrusion attempts. The mechanical attenuation devices produce measurable attenuations to the light pulse. Using backscattering light detection technology an intrusion attempt and the location of an intrusion is detected.

Optical fiber cable based intrusion detection system

A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-&deg;C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Dissipation of heat from a circuit board having bare silicon chips mounted thereon

A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose inner face (facing the circuit board) are applied one or more pads of a gel composition. The pad(s) are positioned opposite the bare silicon chips when the heat spreader is attached to the circuit board and completely cover the exposed faces of the chips. The gel composition has a cohesive strength greater than its adhesive strength, has a compression modulus of less than 1.38 MPa, and has a thermal conductivity greater than 1.0 W/m-.degree. C., and a thickness of between about 0.08 mm and about 1.0 mm. The low compression modulus of the gel material protects the chips from the transmission of mechanical stresses thereto.

Dissipation of heat from a circuit board having bare silicon chips

Growing community of inventors

New Hartford, NY, United States of America

Benjamin Lee Sitler