Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Cornerstone Research Group, Inc.

Benjamin John Vining

Richard D Hreha

Tat Hung Tong

Ravichandra V Palaparthi

Thomas J Barnell

Richard J Hreha

Robert M Schueler

Thomas Barneli

David Nickerson

A method of making shape memory chemical mechanical polishing pads is provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided is a method for using the shape memory chemical mechanical polishing pads to polish substrates.

Chemical mechanical polishing pad and methods of making and using same

Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.

The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.

Shape memory epoxy copolymer

Cyanate ester shape memory polymers (SMP). The polymers are preferably formed via reaction of a multifunctional cyanate ester and a mono functional cyanate ester and exist, in one inventive aspect, in the form of a cross-linked thermoset network. Optional catalysts and structural modifiers may be added to the reaction moieties to help control the glass transition temperature of the resulting SMP to greater than 0&#xb0; C., preferably from about 150&#xb0; C.-300&#xb0; C.

Growing community of inventors

Beavercreek, OH, United States of America

Benjamin John Vining