Isothermal Systems Research, Inc.

Dcg Systems Gmbh

Credence Systems Corporation

Benjamin Hewett Tolman

Tahir Cader

Charles Lester Tilton

Jonathan Frank

Thomas Wong

George Joseph Wos

Alan Brent Roberts

Nathan G Muoio

A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.

Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis

A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.

Semiconductor burn-in thermal management system

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Moscow, ID, United States of America

Benjamin Hewett Tolman