Tesat-spacecom Gmbh & Co Kg

Benjamin Falk

Christian Arnold

Ulrich Mahr

Tobias Janocha

Michael Franz

Sebastian Bartz

Michael Glasbrenner

Ralf Kröner

Maria Wochner

Tobias Kässer

Andre Berger

A radio-frequency assembly is described which can be used in communication satellites, for example. The radio-frequency assembly contains a signal source in the form of a semiconductor amplifier output, an impedance matching filter, and a radio-frequency waveguide. The impedance matching filter is connected to the semiconductor amplifier output on the input side and to the radio-frequency waveguide on the output side. The impedance matching filter has a different impedance value on the input side from that on the output side and is matched to the semiconductor amplifier output on the input side and matched to the radio-frequency waveguide on the output side. Consequently, a separate matching circuit between semiconductor amplifier output and radio-frequency waveguide is no longer necessary.

Radio-frequency assembly with impedance matching filter

A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.

Circuit arrangement consisting of two interconnected high-frequency components

A high-frequency module can be used in communication satellites. The high-frequency module contains an electronic unit and a housing. The housing at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing. An internal connector is arranged on the housing, which is coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector. The internal connector is constructed integrally with at least a part of the housing. This allows a thermo-mechanical stress on the electronic unit to be reduced.

High-frequency module with connection interface

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Backnang, Germany

Benjamin Falk