Alcoa USA Corp.

Other

Benjamin D Mosser

Lance M Sworts

James C McMillen

Charles Robert Shanta, Iii

Alexander M Veytser

Xinghua Liu

Frank R Balma

Brent D Elliot

Harold H Mortensen

New copper-coated titanium diboride electrodes are disclosed. The copper-coated titanium diboride electrodes may be used in an aluminum electrolysis cell. In one embodiment, a method includes installing the copper-coated titanium diboride electrode in the aluminum electrolysis cell and operating the aluminum electrolysis cell. During start-up, the aluminum electrolysis cell may be preheated and a bath may be formed from a molten electrolyte. Alumina (AlO) may in the added to the bath and reduced to aluminum metal. At least some of the copper film of the copper-coated titanium diboride electrode may be replaced by an aluminum film, thereby forming an aluminum-wetted titanium diboride electrode.

Copper-coated titanium diboride articles

In one embodiment, the disclosed subject matter relates to an electrolytic cell that has: a cell reservoir; a cathode support retained on a bottom of the cell reservoir, wherein the cathode support contacts at least one of: a metal pad and a molten electrolyte bath within the cell reservoir, wherein the cathode support includes: a body having a support bottom, which is configured to be in communication with the bottom of the electrolysis cell; and a support top, opposite the support bottom, having a cathode attachment area configured to retain a at least one cathode plate therein.

Apparatuses and systems for vertical electrolysis cells

Systems and methods for making ceramic powders configured with consistent, tailored characteristics and/or properties are provided herein. In some embodiments a system for making ceramic powders, includes: a reactor body having a reaction chamber and configured with a heat source to provide a hot zone along the reaction chamber; a sweep gas inlet configured to direct a sweep gas into the reaction chamber and a sweep gas outlet configured to direct an exhaust gas from the reaction chamber; a plurality of containers, within the reactor body, configured to retain at least one preform, wherein each container is configured to permit the sweep gas to flow therethrough, wherein the preform is configured to permit the sweep gas to flow there through, such that the precursor mixture is reacted in the hot zone to form a ceramic powder product having uniform properties.

Systems and methods for making ceramic powders

Systems and methods for making ceramic powders are provided. The method for forming a ceramic powder includes: preparing a precursor mixture, wherein the preparing comprises adding at least one additive to a plurality of reagents, wherein the at least one additive includes at least one of: an oxide, a salt, a pure metal, or an alloy of elements ranging from atomic numbers 21 through 30, 39 through 51, and 57 through 77 and combinations thereof; and carbothermically reacting the precursor mixture to form a ceramic powder, wherein, due to the preparing step, the precursor mixture comprises a sufficient amount of the at least one additive to form the ceramic powder, wherein the ceramic powder comprises: (a) a morphology selected from the group consisting of irregular, equiaxed, plate-like, and combinations thereof; and (b) a particle size distribution selected from the group consisting of fine, intermediate, coarse, and combinations thereof.

Systems and methods for making ceramic powders and ceramic products

A susceptor including a substrate support and a conductor is provided. The substrate support includes a conductive element, a contact bonded to the conductive element, and a bushing. The conductor is disposed through the bushing and is bonded to the contact. The substrate support can also include a conductive spreader between the contact and the conductive element. A method for fabricating a susceptor is also provided. The method comprises forming a plate including a bushing preform, sintering or hot-pressing a conductive element and a contact between a ceramic layer and the plate to produce a substrate support, forming a conductor opening into the substrate support and through the bushing preform to the contact, and bonding a conductor into the conductor opening.

Growing community of inventors

Pittsburgh, PA, United States of America

Benjamin D Mosser