Robert Boschgmbh

Robert Bosch Gmbh

Benjamin Bertsch

Wolfgang Woernle

Alexander Herrmann

Klaus Voigtlaender

Thomas Mueller

Helmut Bubeck

Stephan Henzler

Matthias Lausmann

Ralf Schinzel

Holger Braun

Conrad Haeussermann

Michael Walther

Martin Schoepf

Roland Seitz

Michel Walz

Arne Stephen Fischer

Lukas Loeber

Florian Fischer

Thorsten Heeling

Julian Binder

Paul Boos

Quoc-Dat Nguyen

A method is described for producing a component, having a first constructive step in which a support material is applied onto a bearer using a photoelectric print method in the first constructive step to form at least one auxiliary structure, the auxiliary structure having and/or forming intermediate spaces, and having a second constructive step, in which a component material is filled into the intermediate spaces using a further photoelectric print method to form a component structure, the auxiliary structure and the component structure forming a blank segment of the component, the component material being a powder, the powder including composite particles, the composite particles being formed by ceramic and/or metallic core particles that include a polymer

Method for producing a component and manufacturing device

A method for producing a sensor housing comprises forming three seals including a first annular seal and a second annular seal connected to each other by a connecting web formed materially integral in a unipartite fashion with the first annular seal and the second annular seal, and positioning the first annular seal and the second annular seal on a housing shell of the sensor housing.

Method for producing a sensor housing and corresponding sensor housing

A pressing element is configured for an electrical component which needs to be pressed against another element for contact. The electrical component includes at least one electrically conductive touch contact. The pressing element has an annular pressing surface for the electrical component. An outer contour of the pressing surface is greater than an outer contour of the electrical component which needs to be pressed. The pressing surface has an annular elevation which forms a bearing surface for the electrical component.

Pressing element, electrical/electronic component

The invention relates to a detection device for detecting a property of a medium, comprising at least one detection sensor, wherein the detection sensor is arranged in a housing, the housing comprising a housing cover. The housing cover is a one-piece molded part, and a compensation element is arranged on or in the housing cover which forms at least one inlet channel with an inlet port for the medium. The inlet channel has a first portion and a second portion, wherein the first portion and the second portion are arranged at an angle different from zero to each other and a closure means closes the first portion of the inlet channel.

Detection device and method for producing a detection device

The invention relates to a sensor device (), in particular for use in a motor vehicle, having a housing () for accommodating a sensor element (), wherein the sensor element () has electrical contact areas () which are connected to electrical plug connections () arranged in the housing () in an electrically conductive manner in the region of contacts () of the plug connections (), wherein a force is applied to the sensor element () for the purpose of making electrical contact with a housing element in the direction of the plug connections (). The invention provides for the electrical plug connections () to be arranged in a stationary manner in the housing () in the region of the contacts () with the electrical contact areas () of the sensor element (), and for a support to be formed between the sensor element () and the housing () in such a manner that the sensor element () has three-point contact in the housing ().

Sensor device, in particular for use in a motor vehicle

The invention relates to an electronic module comprising at least one electronic or electric component (), a base plate (), and a support plate (), in particular a printed circuit board or a substrate. Said support plate () is arranged on the base plate () and comprises conductor paths. Said base plate () comprises a blind hole-type recess () on a side oriented towards the support plate (). The component () is in contact on the support plate () and is arranged in the recess () of the base plate ().

Electronic module

The invention relates to an electronic module, a support plate () having a base area () and at least one connection element (). Said connection element () is a part of the base area () and is arranged at an angle (a) to the base area (), in addition to at least one electronic component (), in particular a sensor, which is arranged in the connection element ().

Electronic module and method for the production thereof

Growing community of inventors

Lichtenstein, Germany

Benjamin Bertsch