Microsoft Technology Licensing, LLC

Benito Joseph Rodriguez

Dillip Kumar Dash

Shu-Ming Chang

Juan-Yi Wu

Po Chun Yang

Rameez Kadar Kazi

Anand Avinash Kulkarni

Christy Felix Pradeep Antony

Nisha Susan John

Robert Forrest Koerner

Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 mil×8 mil cuts or indentations in the copper shape.

Printed circuit board mesh routing to reduce solder ball joint failure during reflow

A system for detecting access to a security sensitive component on an electronic device includes a PCB-mounted connector that provides read/write access to a security sensitive component on the PCB. The system further includes a connector cap that mates with at least a portion of the connector and that includes circuitry that facilitates current flow across at least a portion of the PCB-mounted connector when the connector cap is mated with the PCB-mounted connector, When removed from the PCB-mounted connector, the current flow is disrupted. The system further includes an intrusion detection controller that monitors a voltage at a sampling point adjacent to detect removal of the connector cap and to generate an intrusion logfile entry in response.

Intrusion detection mechanism for security sensitive PCB components

A socket used to connect a processor assembly to a PCB is protected during handling and/or processor installation using a laterally removable pin cover. To install the processor assembly, the processor assembly is paced in a cover removal position. While the processor assembly is in the cover removal position, the laterally removable pin cover is laterally removed from the socket. The processor assembly may then be placed into the installed position without ever exposing the connector pins on the socket.

Laterally removable pin cover to protect socket connector pins

Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 mil&#xd7;8 mil cuts or indentations in the copper shape.

Growing community of inventors

Redmond, WA, United States of America

Benito Joseph Rodriguez