Ericsson Gmbh

Infineon Technologies Ag

Ericcson Inc.

Bengt Ahl

Larry C Leighton

Thomas W Moller

Henrik Hoyer

Prasanth Perugupalli

Tom Moller

A laterally diffused metal oxide semiconductor (LDMOS) power package includes a conductive mounting flange mounted on a heat sink and electrically connected to a dielectric substrate of a printed circuit board. A plurality of transistors are mounted on the top surface of the mounting flange. Each of the transistors has an input terminal, an output terminal, and a ground terminal, with the ground terminal of each transistor being electrically coupled to the top surface of the mounting flange. A plurality of parallel ground signal return paths are provided to electrically couple the top surface of the mounting flange to the dielectric substrate, thereby reducing resistance and inductance in the ground signal path and increasing the efficiency of the power package.

Multiple ground signal path LDMOS power package

A multistage power amplifier circuit with superior isolation between gain stages provides alternative common lead currents paths from the individual gain stage elements to obtain improved stability and operational performance.

Stability enhanced multistage power amplifier

A packaged integrated circuit device includes a substrate including a first circuit component mounted thereon, a first conductor extending from the first circuit component, and a dielectric lid. The dielectric lid includes a component mounting surface, a second circuit component mounted on the component mounting surface, and a second conductor extending from the second circuit component. The dielectric lid is adapted to engage with the substrate such that the first circuit component is in electrical communication with the second circuit component. The second circuit component may comprises an impedance matching circuit. The circuit device may also include fastening means for securing the lid to the substrate. The fastening means may comprise an adhesive, solder, or a spring biased member.

Functional lid for RF power package

An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficient force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.

Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink

A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The leads are electrically coupled with the conductive areas by respective tie-down screws fastened through dielectric isolating washers. The screws are tightened sufficiently against the isolating washers so as to press the respective package leads into solid electrical contact with the conductive areas. Portions of the respective leads and conductive areas surrounding the tie-down screws are cut-away to prevent electrical contact, in order to avoid shorting the leads and/or conductive areas to the heat sink via the tie-down screws. Alternately, respective ends of a retaining spring used to secure the IC package to the heat sink mounting flange are also secured by the package lead tie-down screws, such that the screws both secure the package against the heat sink and press the package leads into solid electrical contact with the respective conductive areas.

Capacitive mounting arrangement for securing an integrated circuit

A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The respective package leads are each connected to the corresponding PC board areas by one or more flexible bond wires. In addition to electrically connecting the package leads to the respective PC board sections, the bond wires collectively secure the package to the heat sink in a manner allowing for relative lateral movement between the respective flange and heat sink surfaces in response to thermal stresses.

Wire bond attachment of a integrated circuit package to a heat sink

A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvelinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other. just so as to cause moderate compression of the opposing ends of the spring toward each other as the package is inserted against the heat sink surface. The opposing surfaces of the two walls are provided with a plurality of notches formed substantially parallel to the heat sink surface in a 'ratchet-type' relief pattern, such that the opposing ends of the retaining-spring are held into place by respective notches, once the IC package is secured against the heat sink.

Growing community of inventors

Gavle, Sweden

Bengt Ahl