Innovative Micro Technology

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Innovative Mion Technology

Benedikt Zeyen

Jeffery Frank Summers

Bede Pittenger

Vikram Patil

Kumar Virwani

A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.

Microfabricated pressure transducer

A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.

Anodic bonding of dielectric substrates

A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Device using glass substrate anodic bonding

A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.

Solder bump sealing method and device

Method using glass substrate anodic bonding

A microfabricated magnetic field transducer uses a magnetically sensitive structure in combination with one or more permeable magnetic flux guides. The flux guides may route off-axis components of an externally applied magnetic field across the sensitive axis of the magnetically sensitive structure, or may shield the magnetically sensitive structure from off-axis, stray fields or noise sources. A combination of flux guides and magnetically sensitive structures arranged on a single substrate may enable an integrated, 3-axis magnetometer in a single package, greatly improving cost and performance.

Microfabricated magnetic field transducer with flux guide

A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a Second bond, for example a metal alloy, solder, eutectic and polymer bond. The two bonds may be used for the same or a different purpose, and may be selected for the following attributes: hermeticity, electrical conductivity, low RF loss, high adhesive strength, leak resistance, thermal conductivity. The attributes for each bonding technology may be the same, or they may be different.

Method and device using silicon substrate to glass substrate anodic bonding

Aspects of the invention are directed to piezoresponse force analysis of a material. A stimulus signal including a first frequency component is applied to a contact point on the material such that the stimulus signal actuates a portion of the material to experience a motion as a result of a piezoelectric effect. A resonant device is coupled to the contact point such that the resonant device experiences a resonant motion at the first frequency component in response to the motion of the material, the resonant motion having a greater displacement than a displacement of the motion of the material, and is substantially unaffected by mechanical properties of the material at the contact point. The resonant motion of the resonant device is detected and processed to produce a measurement representing the piezoresponse of the material at the contact point.

Growing community of inventors

Santa Barbara, CA, United States of America

Benedikt Zeyen