Microchip Technology Inc.

Supertex, Inc.

Benedict C K Choy

Scott Lynch

Ching Chu

Ming-Yuan Yeh

James Terrell Walker

Jimes Lei

Haibing (Robin) Liu

Systems and methods are disclosed for operating a highly linearized resistance for a switch through use of a bootstrapped features. In one exemplary implementation, there is provided a method and system that implements a method for operating a circuit configured to provide a highly linearized resistance including receiving a signal via a bootstrapped switch, coupling the received signal to a gate if the received signal is high, receiving a signal via a switch control input coupled to a high impedance element. Moreover, the method includes coupling the high impedance element to the gate and turning off the switch via a gate turn off when the gate turn off pulls the gate low.

Bootstrapped switch with a highly linearized resistance

An LED driver circuit for controlling direct current supplied to a plurality of serially connected segments of Light Emitting Diodes (LEDs) is disclosed. In one embodiment, the LED driver circuit comprises a self-commutating circuit, which comprises a plurality of current control elements, each current control element having two ends, a first end connected to a different end of each segment along the plurality of serially connected segments of LEDs and a second end connected to a path to ground. The path to ground comprises a sense resistor and the path to ground is shared by the second end of each current control element. Each current control element is coupled to an adjacent current control element by a cross-regulation circuit and controlled by a signal from an adjacent current control element.

Multiple stage sequential current regulator

A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal. The doped polysilicon filled trench also serves to isolate and separate different circuit elements.

Multi-chip package module and a doped polysilicon trench for isolation and connection

An LED driver circuit is disclosed. The top of a string of series connected LED segments is connected to the output of a rectifier, which in turn is connected to an AC source. The string is tapped at various locations, including the bottom of the string. Each segment can consists of any number of serial or parallel connected LEDs. Current control elements or regulators sink current at each tap and are sequentially turned on and off one at a time, tracking the rectified sine wave voltage. Voltage across each regulator and current when conducting is individually controllable. The regulators may control current in a multitude of ways, including a constant current, or a current dependent on voltage across the regulators including a resistor, or a combination. The driver is self-commutating, with the sequencing of the current control elements an inherent feature closely integrated with the current control elements and providing optimal performance over variable operating conditions.

A two terminal transmit receive device passes small analog signals with a constant low resistance value to the input of a low noise, low voltage receiver amplifier and can protect the input against the high voltage transmit signals in ultrasound applications without the aid of any power supplies. The device uses depletion-mode transistors that are normally on to pass small analog signal and a voltage detection circuit that quickly turns off the depletion-mode transistors when the presence of high voltage is detected.

High voltage transmit/receive switch and method therefor

A complementary high voltage switched current source circuit has a complementary current source pair, wherein a first of the current source pair is coupled to a positive voltage rail and a second of the current source pair is coupled to a negative voltage rail. A digital logic-level control interface circuit is coupled to the complementary current source pair and to the positive voltage rail and the negative voltage rail. A pair of high voltage switches is coupled to the complementary current source pair and the digital logic-level control interface circuit and controlled by the digital control interface circuit.

Complementary high voltage switched current source integrated circuit

A ultrasound transmit pulse waveform generator for driving a piezoelectric transducer in medical ultrasound imaging, nondestructive testing (NDT) ultrasound imaging applications, includes a capacitor, switching programmable current sources, and a power amplifier.

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Cupertino, CA, United States of America

Benedict C K Choy