Supertex, Inc.

Benedict C Choy

Richard A Blanchard

Hak-Yam Tsoi

Henry C Pao

The present invention relates to a high voltage output circuit for driving a gray scale flat panel display. The high voltage output circuit eliminates the inaccuracies of prior art output circuits by using a plurality of transistors to eliminate a dead band level within the output circuit. The output circuit is also less expensive than prior art output circuits since a level translator is not required.

High voltage output circuit for driving gray scale flat panel displays

Method and structure is disclosed for a high-density DMOS transistor with an improved body contact. The improvement comprises a self-aligned structure in combination with a body contact region which overdopes the source region in order to minimize the number of critical photoresist steps. The use of two dielectric spacers obviates the need for a separate contact mask.

Self-aligned structure and process for DMOS transistor

A high-voltage level translator circuit is disclosed that is suitable for monolithic integration. The level translator circuit comprises serially-connected current sources suitably ratioed so that the gating on of one current source causes a limited voltage rise across the other current source, which is ungated. The circuit is suitable for integration in a junction-isolated monolithic pseudo-complementary CMOS format.

Integrated mos high-voltage level-translation circuit, structure and

This disclosure relates to a high power VMOS semiconductor device and fabrication method therefor. This VMOS semiconductor device uses a doped polysilicon gate electrode in the V groove and an overlying metal electrode located over an insulation layer protecting the doped polysilicon gate electrode. This overlying metal electrode layer covers substantially the entire surface area (except for a small area where electrical contact is made to the doped polysilicon gate electrode) of one surface of the device. Another embodiment discloses the use of a self-aligned metal contact to the source or drain region of the VMOS device between adjacent V groov

Fabrication method for high power MOS device

This disclosure relates to an improved DMOS semiconductor type device which can function both as a DMOS (unipolar) type device and as a bipolar transistor device. The DMOS device has two separated source regions of, for example, N+ conductivity and each of these source regions is surrounded by a P- type region, thus providing a pair of channels between each N+ source region and a common N type drain region located between the P- regions. A gate electrode is disposed over both of the channels and functions to permit electrons from the N+ source regions to flow across the P- channels into the common N type drain region when a proper bias is applied to the gate region. Each of the source regions has its own electrode and a separate electrode is provided to each of the P- regions that surround each of the respective N+ source regions. Thus, the DMOS type structure can function as a DMOS device with the electrodes to the source regions serving as source electrodes and the gate electrode functioning to permit electron flow from the separated source regions to a common drain region. Alternatively, one of the electrodes to the N+ source region could function as an emitter (or a source electrode for MOS operation) electrode with the electrode to the surrounding P- region serving as a base electrode. To complete the bipolar vertical transistor, a collector electrode is provided electrically coupled to the N- region. Alternatively, the collector electrode serves as the drain electrode if the device is operated as a DMOS device.

Combined DMOS and a vertical bipolar transistor device and fabrication

This disclosure relates to a high power VMOS semiconductor device and fabrication method therefor. This VMOS semiconductor device uses a doped polysilicon gate electrode in the V groove and an overlying metal electrode located over an insulation layer protecting the doped polysilicon gate electrode. This overlying metal electrode layer covers substantially the entire surface area (except for a small area where electrical contact is made to the doped polysilicon gate electrode) of one surface of the device. Another embodiment discloses the use of a self-aligned metal contact to the source or drain region of the VMOS device between adjacent V grooves.

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Saratoga, CA, United States of America

Benedict C Choy