Juniper Networks, Inc.

Ben T Nitzan

Jack W Kohn

Boris Reynov

Shreeram Siddhaye

Venkata S Raju Penmetsa

Euan F Mowat

Mahesh Nagarajan

Oscar Diaz-Landa

Philip Quaife

Victor W Mei

Venkata Penmetsa

Bruce Thompson

A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.

Orthogonal cross-connecting of printed circuit boards without a midplane board

In some embodiments, an apparatus includes a set of power supply units where each power supply unit from the set of power supply units is associated with a power zone from a set of power zones. The apparatus can also include a redundant power supply unit and a set of electronic devices where each electronic device from the set of electronic devices is associated with a power zone from the set of power zones. Additionally, each electronic device from the set of electronic devices is operatively coupled to a power supply unit from the set of power supply units for that power zone and is also operatively coupled to the redundant power supply unit.

Methods and apparatus for providing redundant power supply protection with power zones for electronic devices

A line card includes a metal frame that includes a front section, and a bottom section connected to the front section via an angled section, where the angled section results in an opening between the line card and a second line card, when the line card is installed above the second line card in a rack, and where the opening allows directed air to enter the rack from a front direction; a printed circuit board attached to the metal frame; and a group of front panel connectors attached to the front section of the metal frame.

Chassis system with front cooling intake

In some embodiments, an apparatus includes a set of power supply units where each power supply units from the set of power supply unit is associated with a power zone from a set of power zones. The apparatus can also includes a redundant power supply unit and a set of electronic devices where each electronic device from the set of electronic devices is associated with a power zone from the set of power zones. Additionally, each electronic device from the set of electronic devices is operatively coupled to a power supply unit from the set of power supply units for that power zone and is also operatively coupled to the redundant power supply unit.

In some embodiments, an equipment unit has a set of visual indicators, a power switch, and a set of compute components. The power switch receives a signal representing a status such that when the status is in a first mode, the power switch provides power to the set of visual indicators and when the status is in a second mode the power switch does not provide power to the set of visual indicators. The compute components are configured to receive power when the power switch does not provide power to the set of visual indicators.

Methods and apparatus for reducing energy consumption of network equipment

In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.

Apparatus and methods for coplanar printed circuit board interconnect

A method for cooling a system having a midplane design in which the midplane includes holes to allow air to flow via the midplane. Cards connected to the midplane have a front face that includes holes to allow the air to flow. The air flows from front to back or back to front to cool the cards connected to the midplane. A multi-slot chassis includes rails to support the cards. The rails form spaces to permit access to sockets associated with the cards to which cables may be connected. Platforms associated with the cards may permit a user to manage cables connected to the cards.

Growing community of inventors

El Granada, CA, United States of America

Ben T Nitzan