Xsight Labs Ltd.

Dustphotonics Ltd.

Other

Ben Rubovitch

Guy Koren

Amir Geron

Jacob Hasharoni

Mordechai Cabessa

A method and a high-frequency module that includes a high frequency die that may include multiple die pads; a substrate that may include a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer; a line card that may include multiple line card pads; and multiple conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the multiple line card pads.

Method for conveying high frequency module and a high-frequency module

A method and a high-frequency module that includes (a) a high frequency die that includes multiple die pads, (b) a substrate that comprises a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer, (c) a heat sink and coupling module that comprises a heat sink and multiple first conductors that pass through the heat sink and extend outside the heat sink; (d) a line card that comprises multiple line card pads that are coupled to external ends of the multiple first conductors; (e) coupling elements that are coupled to internal end of the multiple first conductors; and (f) multiple second conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the coupling elements. The high frequency it not lower than fifty gigabits per second.

High-frequency module

A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axis related to the second lens array passes through the point of intersection.

Growing community of inventors

Modiin, Israel

Ben Rubovitch