Rosemount Aerospace Limited

Ben Pingtao Fok

Magdi A Essawy

Scott Darrell Isebrand

Nghia T Dinh

Thomas Wingert

Andrew S Paule

Michael Blesi

Marvin Onken

A pressure sensor includes a header with a cavity, a pressure sensing element, an isolator, an isolator support, a damping gap, and oil. The pressure sensing element is in the cavity. The isolator has corrugations and is mounted to a top of the header. The isolator covers the cavity. The isolator support is in the cavity of the header above the pressure sensing element. The isolator support is corrugated. The corrugations of the isolator support align with the corrugations on the isolator. The damping gap is between the isolator support and the isolator. The damping gap has a constant width between the isolator support and the isolator. Oil fills the damping gap and the cavity in the header. The oil moves between the damping gap and the header cavity in response to external pressure changes moving the isolator.

Pressure sensor with corrugated isolator support

An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.

Unattached contained semiconductor devices

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Farmington, MN, United States of America

Ben Pingtao Fok