Average Co-Inventor Count = 2.56
ph-index = 58
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (592 from 1,851 patents)
2. Rambus Inc. (28 from 2,851 patents)
3. Adeia Semiconductor Technologies LLC (6 from 17 patents)
4. Silicon Pipe, Inc. (4 from 16 patents)
5. Nec Corporation (2 from 35,548 patents)
6. Adeia Semiconductor Inc. (2 from 9 patents)
7. International Business Machines Corporation (1 from 163,830 patents)
8. Samsung Electronics Co., Ltd. (1 from 130,321 patents)
9. Digital Optics Corporation (1 from 135 patents)
10. Tessera Technologies Ireland Limited (1 from 34 patents)
11. Nan Chang O-film Optoelectronics Technology Ltd (1 from 15 patents)
12. Invensas LLC (1 from 5 patents)
13. Xcelsis Corporation (1 from 1 patent)
14. Tessera LLC (9 patents)
641 patents:
1. 12451439 - Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesive
2. 12451445 - Protective elements for bonded structures
3. 12431449 - Circuitry for electrical redundancy in bonded structures
4. 12401011 - Stacked devices and methods of fabrication
5. 12368087 - Embedded cooling systems for advanced device packaging and methods of manufacturing the same
6. 12347820 - Stacked devices and methods of fabrication
7. 12341083 - Electronic device cooling structures bonded to semiconductor elements
8. 12341025 - Microelectronic assemblies
9. 12336141 - Cold plate cavity designs for improved thermal performance
10. 12322718 - Bonded structure with interconnect structure
11. 12322677 - Fluid channel geometry optimizations to improve cooling efficiency
12. 12308332 - Circuitry for electrical redundancy in bonded structures
13. 12300634 - Protective semiconductor elements for bonded structures
14. 12288771 - Apparatus for non-volatile random access memory stacks
15. 12283490 - Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same