Adeia Semiconductor Bonding Technologies Inc.

Rambus Inc.

Adeia Semiconductor Technologies LLC

Silicon Pipe, Inc.

Adeia Semiconductor Inc.

Nec Corporation

International Business Machines Corporation

Samsung Electronics Co., Ltd.

Digital Optics Corporation

Tessera Technologies Ireland Limited

Adeia Semiconductor Solutions LLC

Nan Chang O-film Optoelectronics Technology Ltd

Invensas LLC

Xcelsis Corporation

Tessera LLC

Belgacem Haba

Ilyas Mohammed

Wael Zohni

Richard Dewitt Crisp

Vage Oganesian

Craig S Mitchell

Rajesh Katkar

Cyprian Emeka Uzoh

Piyush Savalia

Javier A DeLaCruz

Masud Beroz

Frank Lambrecht

Teck-Gyu Kang

Ellis Chau

Guilian Gao

Laura Wills Mirkarimi

Philip Damberg

Hiroaki Sato

Giles Humpston

Gaius Gillman Fountain, Jr

Terrence Caskey

Joseph Charles Fjelstad

David Bazeley Tuckerman

John W Smith

Liang Wang

Charles Gerard Woychik

Zhuowen Sun

Kishor V Desai

David Nguyen

Shaowu Huang

Konstantine N Karavakis

Reynaldo Co

Arkalgud R Sitaram

Pezhman Monadgemi

Thomas H DiStefano

Ashok S Prabhu

Yong Qin Chen

Paul M Enquist

Donald Victor Perino

David Noel Light

Jeremy Alfred Theil

Ely K Tsern

Richard E Perego

Hong Shen

Jung Ko

Billy Wayne Garrett, Jr

Craig Edward Hampel

Stephen L Morein

Lubomyr Taras Romankiw

Ming Chu Li

Philip R Osborn

Norihito Masuda

Yoichi Kubota

Kiyoaki Hashimoto

David Ovrutsky

Wei-Shun Wang

Gabriel Z Guevara

Kazuo Sakuma

Kyong-Mo Bang

Min Tao

Tomoyuki Kikuchi

Kurosawa Inetaro

Michael W Newman

Sayeh Khalili

Brian Marcucci

Jae M Park

Bongsub Lee

Thomas Workman

Ron Zhang

Michael Warner

Kimitaka Endo

Anthony B Faraci

John B Riley, Iii

Michael James Nystrom

Kenneth Allen Honer

Thomas Francis Fox

Richard E Warmke

Xingchao C Yuan

Jesse B Thompson

Stuart E Wilson

Charles Rosenstein

Ravindranath T Kollipara

Young-Gon Kim

Ronald Patrick Green

Vernon Solberg

Yukio Morishige

Moti Margalit

Para Kanagasabai Segaram

Moshe Kriman

David A Gibson

Para K Segaram

Akash Agrawal

Andrey Grinman

Donald R Mullen

Arunava Gupta

David Edward Fisch

Kazumi Sugai

Hamid Eslampour

Lee John Smith

Adeia Celebrates Semiconductor Technology Pioneer, Dr. Belgacem Haba, who has helped Revolutionize the Semiconductor Industry with Groundbreaking Inventions

Embedded organic interposers for high bandwidth are provided. Example embedded organic interposers provide thick conductors with more dielectric space, and more routing layers of such conductors than conventional interposers, in order to provide high bandwidth transmission capacity over longer spans. The embedded organic interposers provide high bandwidth transmission paths between components such as HBM, HBM2, and HBM3 memory stacks, and other components. To provide the thick conductors and more routing layers for greater transmission capacity, extra space is achieved by embedding the organic interposers in the core of the package. Example embedded organic interposers lower a resistive-capacitive (RC) load of the routing layers to provide an improved data transfer rate of 1 gigabits per second over at least a 6 mm span, for example. The embedded interposers are not limited to use with memory modules.

Embedded organic interposer for high bandwidth

Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Package-on-package assembly with wire bonds to encapsulation surface

Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a metal pad having a larger diameter or surface area (e.g., oversized for the application) may be used when a contact pad is positioned over a TSV in one or both substrates.

Metal pads over TSV

Aspects of the disclosure relate to forming a completed stack of layers. Forming the completed stack of layers may include forming a first stack of layers on a first substrate and forming a second stack of layers on a second substrate. The first stack of layers may be bonded to the second stack of layers. The first or second substrate may be removed. Prior to bonding the first stack of layers and the second stack of layer, one or more holes may be etched in the first stack of layers. After removing the second substrate, one or more holes may be etched in the second stack of layers, wherein each of the one or more holes in the second stack of layers extend into a corresponding hole in the one or more holes in the first stack of layers.

3D NAND-high aspect ratio strings and channels

A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry and a first bonding layer. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over the active circuitry and a second bonding layer on the obstructive material. The second bonding layer can be directly bonded to the first bonding layer without an adhesive. The obstructive material can be configured to obstruct external access to the active circuitry.

Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesive

A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element.

Protective elements for bonded structures

A bonded structure is disclosed. The bonded structure can include a first element that has a first plurality of contact pads. The first plurality of contact pads includes a first contact pad and a second redundant contact pad. The bonded structure can also include a second element directly bonded to the first element without an intervening adhesive. The second element has a second plurality of contact pads. The second plurality of contact pads includes a third contact pad and a fourth redundant contact pad. The first contact pad is configured to connect to the third contact pad. The second contact pad is configured to connect to the fourth contact pad. The bonded structure can include circuitry that has a first state in which an electrical signal is transferred to the first contact pad and a second state in which the electrical signal is transferred to the second contact pad.

Circuitry for electrical redundancy in bonded structures

Stacked devices and methods of fabrication are provided. Die-to-wafer (D2W) direct-bonding techniques join layers of dies of various physical sizes, form factors, and foundry nodes to a semiconductor wafer, to interposers, or to boards and panels, allowing mixing and matching of variegated dies in the fabrication of 3D stacked devices during wafer level packaging (WLP). Molding material fills in lateral spaces between dies to enable fan-out versions of 3D die stacks with fine pitch leads and capability of vertical through-vias throughout. Molding material is planarized to create direct-bonding surfaces between multiple layers of the variegated dies for high interconnect density and reduction of vertical height. Interposers with variegated dies on one or both sides can be created and bonded to wafers. Logic dies and image sensors from different fabrication nodes and different wafer sizes can be stacked during WLP, or logic dies and high bandwidth memory (HBM) of different geometries can be stacked during WLP.

Stacked devices and methods of fabrication

A device package comprising an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device. The cold plate comprises a top portion, sidewalls extending downwardly from the top portion to a backside of the semiconductor device, an inlet opening, and an outlet opening. The top portion, the sidewalls, and the backside of the semiconductor device collectively define a coolant chamber volume therebetween. The inlet opening and the outlet opening are disposed in the top portion and are in fluid communication with the coolant chamber volume. The inlet opening is disposed above a hotspot region of the semiconductor device.

Embedded cooling systems for advanced device packaging and methods of manufacturing the same

A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid communication with the inlet and outlet, forming a plurality of nozzles on the first side of a second substrate, and forming a plurality of channels on the second side of the second substrate opposite the first side of the second substrate. The plurality of channels is aligned with the plurality of nozzles, and the second side of the first substrate is bonded to the first side of the second substrate.

Electronic device cooling structures bonded to semiconductor elements

Various embodiments of fanout packages are disclosed. A method of forming a microelectronic assembly is disclosed. The method can include bonding a first surface of at least one microelectronic substrate to a surface of a carrier using a direct bonding technique without an intervening adhesive, the microelectronic substrate having a plurality of conductive interconnections on at least one surface of the microelectronic substrate. The method can include applying a molding material to an area of the surface of the carrier surrounding the microelectronic substrate to form a reconstituted substrate. The method can include processing the microelectronic substrate. The method can include singulating the reconstituted substrate at the area of the surface of the carrier and at the molding material to form the microelectronic assembly.

Microelectronic assemblies

A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a semiconductor device and a cold plate attached to the semiconductor device. The cold plate comprises a first side, a second side vertically adjacent to the first side, a first inlet, a first cavity, and a first outlet. The first side of the cold plate comprises a first region, a second region, and a third region, wherein the second region is between the first region and the third region. In some embodiments, the semiconductor device is attached to the first region of the cold plate and the third region of the cold plate, and the first cavity extends along the second region of the cold plate.

Cold plate cavity designs for improved thermal performance

A bonded structure is disclosed. The bonded structure can include an interconnect structure. The bonded structure can also include a first die directly bonded to the interconnect structure. The bonded structure can also include a second die mounted to the interconnect structure. The second die is spaced apart from the first die laterally along an upper surface of the interconnect structure. The second die is electrically connected with the first die at least partially through the interconnect structure. The bonded structure can further include a dielectric layer that is disposed over the upper surface of the interconnect structure between the first die and the second die.

Bonded structure with interconnect structure

Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the integrated cooling assembly includes a semiconductor device and a cold plate attached to the semiconductor device. The cold plate has a perimeter sidewall, a top portion and pairs of opposing cavity sidewalls. The perimeter sidewall extends downwardly from the top portion to a backside of the semiconductor device to define a perimeter of the cold plate. Each pair of opposing cavity sidewalls extends downwardly from the top portion towards the backside of the semiconductor device to define a coolant chamber volume therebetween. A distance between each pair of opposing cavity sidewalls in a direction parallel with the backside of the semiconductor device defines a width of a corresponding coolant chamber volume and a spacing between adjacent coolant chamber volumes, wherein the ratio of width to spacing is about 1:1.

Fluid channel geometry optimizations to improve cooling efficiency

Growing community of inventors

Saratoga, CA, United States of America

Belgacem Haba