Saint-gobain/norton Industrial Ceramics Corporation

Sprague Electric Company

Allegro Microsystems, LLC

Saint-gobain Industrial Ceramics, Inc.

Saint Gobain/norton Company Industrial Ceramics Corp.

Bela G Nagy

Louis K Bigelow

Rakesh R Kapoor

Eric E Olson, Jr

Scott M Hamel

David Shum

Yehya M Kasem

John Cooper

Alfredo H Saab

Arjun Partha

Brian Kochan

Leonard G Feinstein

An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate.

Integrated circuit package with diamond heat sink

An electrical connection for a ceramic hot surface element in which the ends of the hot surface element are essentially interference fit within a pair of metallic termination sleeves, and electrical connection to the hot surface element is provided by an active metal braze which is directly chemically bonded to the metallic termination.

Solderless ceramic igniter having a leadframe attachment

The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium-containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..

Brazing of diamond film to tungsten carbide

An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond or diamond-coated silicon carbide or molybdenum, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate. The thermal connection can be by bonding the pins directly to the substrate.

Precision measuring instruments having highly parallel and wear-resistant contact members and a method for fabricating these contact areas are disclosed. The measuring instruments preferably include two contact members each having diamond coated ceramic substrates. The method for diamond coating the contact members of the measuring instruments includes, for each contact member, preparing a ceramic substrate to high tolerance so that it has two surfaces which are parallel within 0.25 microns, diamond coating one surface of the substrate by any one of several chemical vapor deposition (CVD) techniques, and metalizing the other surface of the substrate for affixing it to the contact member of the measuring instrument. The metalized surface of the substrate is preferably affixed to the contact members of the measuring instrument by brazing, gluing or welding. Preferred embodiments of the measuring instruments with diamond coated contact areas include calipers and micrometers. The provided measuring instruments can be used to measure extremely abrasive materials such as sandpaper and grinding wheels without suffering any appreciable wear to their contact surfaces over a long period of time.

Method of making measuring instruments with diamond coated contacts

Measuring instrument with diamond coated contacts

The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..

The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vandium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15.degree..

A combination measuring and ablation laser apparatus is provided which generally includes an ablating laser, a profilometer laser, an automatic feedback control unit and electro-mechanical positioning apparatus. The combination measuring and ablation laser apparatus can have a single multi-mode laser having an ablating mode and a measuring mode and a positioning means for positioning the laser between ablating and measuring modes. In operation, the profilometer laser measures the thickness of a diamond sample and compares it to the desired thickness. Where the measured thickness is too large, the feedback control unit activates the ablating laser for a predetermined time interval to smoothen any irregularities which may be contributing to the diamond sample thickness. At the end of the time interval, the portion is remeasured by the profilometer laser to determine if it conforms to the desired thickness. If the portion still fails to conform to the desired thickness, the feedback control unit repeats the steps of positioning and activating the ablation laser to further ablate the portion. This process is repeated until the thickness of the portion is equal or less than the desired thickness, after which the same procedure is used on the rest of the diamond sample until a uniform desired thickness is achieved throughout.

Laser finishing and measurement of diamond surface roughness

A lead frame and die sub-assembly is first manufactured by a conventional method including bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is stacked first adjacent a dielectric plastic sheet that is in turn stacked against a metal heat spreader block. The dielectric sheet has a centrally located hole registered with the die attach pad. A dollop of an uncured resin is dispensed in the gap between the die attach pad and block. This assembly is compressed between two hot platens whereby the lead fingers, dielectric sheet and the block are bonded together and the resin dollop is flattened to a controlled thickness, namely the thickness of the dielectric sheet. The thickness of the dielectric sheet controls the flattened thickness of the cured resin dollop. After the platens are withdrawn, the local portion of the lead frame having been bonded in the stack is then put into a mold and the stack assembly encapsulated in a thermosetting resin to produce the semiconductor package.

Method for making a semiconductor package with the distance between a

A power factor controller for a motor is of the type having a bidirectional triode thyristor and a circuit for sensing the voltage across the thyristor to determine the time by which the current lags the line voltage and for generating a signal voltage across an integrating capacitor that is inversely proportional to the current lag time. In addition, a voltage ramp generator produces a ramp voltage having a slope that increases as the lag time decreases. A sum of the signal voltage and ramp voltage is applied to the input of a threshold detector that triggers firing of the thyristor when a predetermined threshold is reached. The entire controller employs only five integrated switches or gates and two individual transistors, and power dissipation, size and cost are thereby minimized.

Power factor controller

A liquid level detector 'stick' includes a column of Hall-cells adapted to be mounted vertically in a liquid's containing tank. One or more toroidal magnets are slidably fitted about the stick. A float elevates the topmost magnet to the level of liquids in the tank. If the liquids comprise two immiscible parts, a second of the magnets may be floated at the surface of the denser liquid part. A very low power electronic system continuously scans the Hall-cells and determines which particular one or ones of them are adjacent a magnet. This detector may be used in a gasoline station storage tank that may also contain water, providing accurate measure of both liquids. It is also capable of operating in a monitor mode for sounding an alarm when a change in the level of either liquid part occurs that may indicate leakage into or from the tank or an attempted theft.

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Acton, MA, United States of America

Bela G Nagy