Skyworks Solutions, Inc.

Scientific Components Corporation

Behnam Tabrizi

Aaron Vaisman

Harvey L Kaylie

Gennady Simkin

Benjamin Kahtan

Himat Hayer

An apparatus for a shielding structure for surface-mount components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

Apparatus for shielding of surface-mount devices

The wrench adaptor of this invention provides an easy and convenient tool for connection and disconnection of the SMA connections in constrained spaces while allowing use of a standard torque wrench or just fingers. The channel design of the wrench adaptor, accommodating the cable and the protective sleeve therefor, allows access to SMA connectors without bending or disturbing semi-rigid or rigid cables. The wrench adaptor is shown in two embodiments&#x2014;a single-ended and a double-ended form. The adaptor facilitates access to the hexagonal nut at the panel of an RF device which is mounted to a threaded stud and offsets the wrench application to a location away from the panel. As many of the RF cables have crimped or soldered portions adjacent or within the connector, provision is made in the adaptor by way of a hollow semicylindrical form to cradle the semi-rigid or rigid cable.

Wrench adaptor

A method of packaging a semiconductor device that incorporates the formation of cavities about electronic devices during the packaging process. In one example, the device package includes a first substrate having a first recess formed therein, a second substrate having a second recess formed therein, and an electronic device mounted in the first recess. The first and second substrates are joined together with the first and second recesses substantially overlying one another so as to form a cavity around the electronic device.

Method for wafer level packaging of electronic devices

A semiconductor packaged device, and method of packaging that incorporates the formation of cavities about electronic devices during the packaging process. In one example, the device package includes a first substrate having a first recess formed therein, a second substrate having a second recess formed therein, and an electronic device mounted in the first recess. The first and second substrates are joined together with the first and second recesses substantially overlying one another so as to form a cavity around the electronic device.

Wafer level packaging using flip chip mounting

An electronic component and a method for making an electronic component are disclosed. The electronic component has a silicon package. The silicon package has a recess formed thereon in which a conductive region is placed. A bare die electronic device is disposed in the recess. The device has a top, a bottom, sides and a plurality of terminals, including a non-top terminal. The non-top terminal is electrically coupled to the conductive region. The electronic component is constructed by first creating a recess in a silicon wafer to a depth substantially equal to the first dimension of the bare die electronic device. A conductive material is applied to the recess. The electronic device is inserted into the recess so that the bottom terminal is coupled to the conductive material. A dielectric or other planarizing material is applied into the recess. Top and bottom contacts are then applied to form the electronic component so that it may be used as a ball grid array package. The top contact is electrically coupled to the top terminal of the electronic device and the bottom contact is coupled electrically to the conductive material.

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Harvard, MA, United States of America

Behnam Tabrizi