Dow Global Technolgoies LLC

Ddp Specialty Electronic Materials US, LLC

Beda Steiner

Andreas Lutz

Cathy Grossnickel

Jeannine Flueckiger

Felix Koch

Benjamin Haag

Benjamin Alexander Haag

Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.

Epoxy resin adhesive compositions

The invention relates to resin compositions for epoxy adhesives, comprising a di-functional aromatic epoxy compound. The resin compositions and/or uncured adhesive compositions having low viscosity at low temperatures. Adhesives made therefrom have good strength and bulk properties. The invention includes methods of making and using the compositions, as well as adhesives made from the compositions.

Epoxy two-part formulations

Two-component epoxy-based structural adhesives are disclosed which exhibit excellent impact resistance, even when cured at approximately room temperature. The adhesives include an epoxy resin component which includes an epoxy resin and a reactive tougher. The adhesives also include a hardener component, which includes from 15 to 50 weight percent of an amine-terminated polyether, from 4 to 40 weight percent of an amine terminated rubber having a glass transition temperature of &#x2212;40&#xb0; C. or below, and from 10 to 30 weight percent of an amine-terminated polyamide having a melting temperature of no greater than 50&#xb0; C.

Two part crash durable epoxy adhesives

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Schaenis, Switzerland

Beda Steiner