Taiwan Semiconductor Manufacturing Comp. Ltd.

Becky Liao

Jiun-Rong Pai

Hsu-Shui Liu

Shou-Wen Kuo

Chien-Fa Lee

Sheng-Hsiang Chuang

Chien-Ko Liao

Wu-An Weng

Chia-Han Lin

Ya Hsun Hsueh

Gary Tsai

Ethan Yu

Ming-Chi Tsai

Surendra Kumar Soni

Kuo-Yi Liu

Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Automated inspection tool

Growing community of inventors

Taichung, Taiwan

Becky Liao