Bystronic Laser Ag

Beat Beutler

Daniel Cathry

Sven Rauschenbach

Methods for configuring laser machining machines () include control (), whereby different types laser machining processes (A, B, C, D) can be executed using the laser machine (), these processes being respectively controlled by the control apparatus () using process parameters. The processes of different types are categorized in a classification (), in which a respective set of process parameters (A-A;B-B;C-C;D-D), that are used during the execution of the respective process (A, B, C, D), is assigned to each process. During a determination and/or changing of a first process parameter (A-A) of a first process (A), a process parameter (S-SB-B;C-C;D-D) of a different process (B, C, D) that is contained within classification (), is automatically determined and/or changed according to a stored rule, as a function of the first process parameter.

Method for configuring a laser machining machine

Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular COlaser), including at least one laser processing head (), having interior () and nozzle () with nozzle orifice () for allowing a primary beam (), in particular a focused laser working beam, to pass through and onto a work piece () and to align a gas current enveloping the beam, and an alignment device () with several sensors () for centering the primary beam (), in particular a focused laser working beam, and the nozzle orifice () relative to each other. At least one conversion unit (), in particular a conversion edge, is provided in the area of the nozzle orifice () for converting the primary beam () contacting it or impacting on it into one or more secondary electromagnetic heat beams () along at least one propagation direction (A) in direction of the sensors (). The sensors () are configured as radiation sensors and arranged in the interior () of the laser processing head () or the nozzle ().

Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam

The laser cutting system for cutting a workpiece with a laser beam along a cutting line at a variable cutting speed includes a movable machining head for placing the laser beam on the respective workpiece, a user interface for specifying the respective cutting line and for specifying a minimum path accuracy of the laser beam, and a control device for controlling a movement of the machining head along the cutting line relative to the respective workpiece and for controlling a plurality of process variables of a cutting process. A second subset of the process variables comprises exclusively one or more process variables which have no influence on the power of the laser beam available for cutting. At least one process variable of the second subset can be controlled by way of the control device as a function of at least one variable control parameter.

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Oberoenz, Switzerland

Beat Beutler